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US 2018/0122725 A1Published application
Semiconductor die package and manufacturing method
AssigneeFairchild Korea Semiconductor Ltd.
InventorsSeungwon IM, Mankyo JONG, Joonseo SON, Oseob JEON
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Abstract
In a general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate. The apparatus can include a conductive clip coupled to the semiconductor die. The leadframe can be disposed between the semiconductor die and the substrate, and the semiconductor die can be disposed between the conductive clip and the leadframe.
Claims20
An apparatus, comprising:
- a semiconductor die;
- a substrate;
- a leadframe coupled to the substrate;
- and
- a conductive clip coupled to the semiconductor die, the leadframe disposed between the semiconductor die and the substrate, the semiconductor die being disposed between the conductive clip and the leadframe.
2 more elements
An apparatus, comprising:
- a leadframe;
- a first semiconductor die coupled to a top side of the leadframe;
- a second semiconductor die coupled to a bottom side of the leadframe;
- a substrate coupled to the bottom side of the leadframe;
- and
- a conductive clip coupled to a top side of the first semiconductor die.
3 more elements
An apparatus, comprising:
- a first semiconductor die;
- a second semiconductor die;
- a substrate;
- a leadframe coupled to the substrate;
- and
- a conductive clip coupled to the first semiconductor die, the leadframe disposed between the first semiconductor die and the substrate, the second semiconductor die being disposed between the leadframe and the substrate.
3 more elements
Dependencies are inferred from the claim text.