Semiconductor Device Having Leadframe With Pressure-Absorbing Pad Straps

A method for fabricating a semiconductor device comprising the steps of:

• providing a leadframe strip having a plurality of device sites, each site patterned into an assembly pad with rectangular sides, the pad extending, on one pad side, into a lead and, on the opposite pad side, into straps oriented normal to the side and anchored in adjacent tie bars, strap surfaces having recesses for interlocking with package materials;
• the leadframe further having leads parallel to and alternating with the straps;
• attaching semiconductor chips onto the pads;
• connecting each chip to respective leads using bonding wires;
• forming a plurality of packages by encapsulating the chip, wires and straps of each site in a packaging material, thereby interlocking the material with the surface recesses of the straps, leaving portions of the leads un-encapsulated;
• trimming the leadframe strip by severing the straps at the surface of the packages and singulating the strip into discrete packages;
• and
• forming the un-encapsulated portions of the leads.