Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorYoshihiro KODAIRA
Life of this patent
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Abstract
A semiconductor device is provided, including: a bottom portion having a pad formed of a conductive material; a lid portion covering at least a part of the bottom portion; and a first terminal portion and a second terminal portion which are provided in parallel with each other, are fixed to the lid portion, and each contact a corresponding pad, wherein: the first terminal portion is provided with a first plate-shaped portion; the second terminal portion is provided with a second plate-shaped portion; and each of the first plate-shaped portion and the second plate-shaped portion has a principal surface in a direction facing the pad and is flexible in a direction toward the pad.
Claims10
A semiconductor device comprising:
- a bottom portion having a pad formed of a conductive material;
- a lid portion covering at least a part of the bottom portion;
- a first terminal portion and a second terminal portion which are provided in parallel with each other, are fixed to the lid portion, and each contact a corresponding pad;
- a plurality of main terminals which form a current path of a large current flowing in a power device;
- and
- a plurality of control terminals, each of which has a shape of a plate whose width is smaller than each of the plurality of main terminals, wherein:
- the plurality of control terminal are the first terminal portion and the second terminal portion;
- the first terminal portion is provided with a first plate-shaped portion and the second terminal portion is provided with a second plate-shaped portion;
- and
- each of the first plate-shaped portion and the second plate-shaped portion has a principal surface in a direction facing the pad and is flexible in a direction toward the pad.
Dependencies are inferred from the claim text.