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US 2018/0122715 A1Published application
Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorYoshihiro KODAIRA
Life of this patent
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Abstract
A semiconductor device is provided. The semiconductor device includes a terminal portion and a casing portion. The terminal portion has a through hole in a principal surface portion. The casing portion has a depression at a position facing the through hole and has an end surface facing portion facing an end surface of the terminal portion. An end surface protruding portion is provided on at least one of the end surface and the end surface facing portion.
Claims12
A semiconductor device comprising:
- a terminal portion having a through hole in a principal surface portion;
- and
- a casing portion having a depression at a position facing the through hole, wherein
- the casing portion has an end surface facing portion facing an end surface of the terminal portion, and
- an end surface protruding portion is provided on at least one of the end surface and the end surface facing portion.
2 more elements
Dependencies are inferred from the claim text.