Manufacturing method of electronic component
AssigneeCanon Kabushiki Kaisha
InventorShin Hasegawa
Life of this patent
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Abstract
Provided is a manufacturing method of an electronic component, the manufacturing method including steps of: preparing a substrate having a first primary surface and a second primary surface, a first conductor layer being disposed on the first primary surface, and the substrate having a through hole arranged to reach the first conductor layer; forming a second conductor layer on the second primary surface, on a side surface of the through hole, and on the first conductor layer located at a bottom of the through hole; and forming a third conductor layer in the through hole by supplying a current from the first conductor layers and the second conductor layers to perform electroplating.
Claims18
A manufacturing method of an electronic component, the manufacturing method comprising steps of:
- preparing a substrate having a first primary surface and a second primary surface, a first conductor layer being disposed on the first primary surface, and the substrate having a through hole arranged to reach the first conductor layer;
- forming a second conductor layer on the second primary surface, on a side surface of the through hole, and on the first conductor layer located at a bottom of the through hole;
- and
- forming a third conductor layer in the through hole by supplying a current from the first conductor layers and the second conductor layers to perform electroplating.
Dependencies are inferred from the claim text.