Planar substrate edge contact with open volume equalization pathways and side containment
AssigneeLam Research Corporation
InventorsPatrick Breiling, Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Adrien LaVoie, Chloe Baldasseroni, Shankar Swaminathan, lshtak Karim, Yukinori Sakiyama, Edmund Minshall, Sung Je Kim, Andrew Duvall, Frank Pasquale
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