Electrostatic chuck assembly and semiconductor manufacturing apparatus including the same
AssigneeSamsung Electronics Co., Ltd.
InventorSong-yi YANG
Life of this patent
Estimating the term…
Abstract
An electrostatic chuck assembly includes an electrostatic chuck including a circular-shaped electrostatic dielectric layer on which a wafer is mounted and an adsorption electrode in the electrostatic dielectric layer, and a control part configured to control the electrostatic chuck, wherein the adsorption electrode comprises a plurality of sub-adsorption electrodes separated from each other in an X direction and a Y direction perpendicular to the X direction on a plane level from a central portion of the electrostatic dielectric layer.
Claims23
An electrostatic chuck assembly, comprising:
- an electrostatic chuck including a circular-shaped electrostatic dielectric layer, on which a wafer is mounted, and an adsorption electrode in the electrostatic dielectric layer;
- and
- a control part to control the electrostatic chuck,
- wherein the adsorption electrode includes a plurality of sub-adsorption electrodes separated from each other in an X direction and a Y direction perpendicular to the X direction on a plane level from a central portion of the electrostatic dielectric layer.
-8. (canceled)
-11. (canceled)
An electrostatic chuck assembly, comprising:
- an electrostatic chuck including a base, an electrostatic dielectric layer on the base, and an adsorption electrode in the electrostatic dielectric layer to adsorb a wafer mounted on the electrostatic dielectric layer;
- and
- a control part to control the electrostatic chuck,
- wherein the adsorption electrode includes a plurality of sub-adsorption electrodes separated from each other in an X direction and a Y direction perpendicular to the X direction on a plane level from a central portion of the electrostatic dielectric layer,
- wherein a top surface of the electrostatic dielectric layer includes at least one protrusion that contacts the wafer, and at least one recess portion that does not contact the wafer, and
- wherein a gas channel is connected to the at least one recess portion to provide a thermally conductive gas through the electrostatic chuck to control a temperature of the wafer.
-30. (canceled)
An electrostatic chuck, comprising:
- an electrostatic dielectric layer on a base, the electrostatic dielectric layer to support a wafer;
- and
- an adsorption electrode within the electrostatic dielectric layer, the adsorption electrode including a plurality of sub-adsorption electrodes separated from each other in an X direction and a Y direction perpendicular to the X direction, and bottom surfaces of all the sub-adsorption electrodes being substantially level with each other and parallel to a bottom surface of the electrostatic dielectric layer.
Dependencies are inferred from the claim text.