Wafer alignment method and apparatus for overlay measurement
AssigneesSemiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
InventorsLIWAN YUE, QIANG WU
Life of this patent
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Abstract
A substrate alignment device includes a plurality of state detection units, each of which is configured to move from a standby position to a detection position for detecting a positional state of a substrate and return back from the detection position back to the standby position, and a multidimensional robot arm configured to receive and support the substrate, transfer the substrate to a substrate detection site, and adjust the substrate in at least one orientation or position according to the detected positional state of the substrate to position the substrate to a target position for overlay mark measurements.
Claims22
A substrate alignment device, comprising:
- a plurality of state detection units each configured to move from a standby position to a detection position for detecting a positional state of a substrate and return back from the detection position back to the standby position;
- a multidimensional robot arm configured to:
- receive and support the substrate;
- transfer the substrate to a substrate detection site;
- and
- adjust the substrate in at least one orientation according to the detected positional state of the substrate to position the substrate to a target position.
A detection system, comprising:
- a substrate alignment device comprising:
- a plurality of state detection units each configured to move from a standby position to a detection position for detecting a positional state of a substrate and return back from the detection position back to the standby position;
- a multidimensional robot arm configured to:
- receive and support the substrate;
- transfer the substrate to a substrate detection site;
- and
- adjust the substrate in at least one orientation according to the detected positional state of the substrate to transport the substrate to a target position;
- and
- a at least one detection device configured to detect a plurality of marks on a surface of the substrate, the marks each comprising a first stripe group and a second stripe group disposed parallel to each other, the at least one detection device comprising:
- at least one detection module operative to move over and traverse across the surface of the substrate in one direction and to obtain information from a corresponding mark, the at least one detection device operative to perform repeated acquisition operations on the first stripe group and the second stripe group of the corresponding mark to obtain data therefrom;
- and
- at least one positioning unit configured to position the at least one detection module to align with the corresponding mark.
Dependencies are inferred from the claim text.