High Density Tec-Cell Carrier
AssigneeTec-Sem AG
InventorsGerhard Dovids, Yves Fenner, John Fiddes, Christian Wohanka, Bernd Rahrbach
Life of this patent
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Abstract
The invention disclosed relates generally to handling substrates and wafers. In an example embodiment, to an improved wafer and substrate carrier or carrier system, method or apparatus. More specifically, to a carrier with improved abilities which may provide high density carriers, improved efficiency and other abilities such as increased cleanliness and reduced contamination to wafers during handling, storage or processing as well as higher density storage and better stocking, storage and handling abilities.
Claims20
A substrate manufacturing, processing, transfer or storage system wherein includes at least:
- one or more carriers, wherein:
- each carrier holds a single substrate or wafer,
- carriers are stacked vertically wherein carriers key into each other, such that the substrates held do not touch above or below substrates or carriers,
- multiple stations including at least
- one or more storage or stocker stations with storage or stocking containers or compartments where the carriers and substrates are housed,
- one or more opener stations wherein the opener station is able to transfer carriers from a high density configuration to a low density configuration and vice versa, and
- one or more transfer robots wherein the transfer robots are able to move the carriers or substrates from one area, position, location or station to another either individually or as a stack.
A substrate manufacturing, processing, transfer or storage method wherein includes at least:
- providing one or more carriers, wherein:
- each carrier holds a single substrate or wafer and carriers are stacked vertically such that the substrates held do not touch above or below substrates or carriers and there is a membrane between each stacked carriers and substrates,
- one or more stocker or storage stations, wherein:
- carriers and substrates are stacked and stored in a high density formation in the containers or storages,
- accessing carriers wherein:
- there are one or more robots and one or more opener stations wherein
- first, one or more substrates and carriers are held in one or more stocker compartments or storages in one or more high density stacks,
- second, a first stack is accessed by a robot wherein the robot transfers the first stack to an opener station, wherein the opener station opens the first stack from a high density configuration to a configuration wherein the carriers or substrates are accessible by a robot.
Dependencies are inferred from the claim text.