Compliant Needle for Direct Transfer of Semiconductor Devices
AssigneeRohinni, LLC
InventorsJustin Wendt, Andrew Huska, Cody Peterson, Clinton Adams, Sean Kupcow
Life of this patent
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Abstract
An apparatus includes a needle and a needle actuator to move the needle to a position at which the needle presses an electrically-actuatable element into contact with a circuit trace. When the needle presses the electrically-actuatable element into contact with the circuit trace, a dampener, arranged with the needle and the needle actuator, dampens a force applied to the electrically-actuatable element.
Claims20
An apparatus configured to transfer an electrically-actuatable element directly from a first side of a wafer tape to a product substrate having a circuit trace thereon, the apparatus comprising:
- a needle disposed adjacent a second side of the wafer tape opposite the first side of the wafer tape;
- a needle actuator to move the needle to a position at which the needle presses on the second side of the wafer tape to press the electrically-actuatable element into contact with the circuit trace disposed adjacent the first side of the wafer tape;
- and
- a dampener arranged with an end of the needle and an end of the needle actuator, the dampener dampening a force applied to the electrically-actuatable element when the needle presses the electrically-actuatable element into contact with the circuit trace.
An apparatus comprising:
- a first frame configured to hold a wafer tape having a first side and a second side, a semiconductor device die being disposed on the first side of the wafer tape;
- a second frame configured to hold a product substrate having a circuit trace thereon, the second frame to hold the product substrate such that the product substrate is disposed facing the semiconductor device die on the wafer tape;
- a needle disposed adjacent the first frame;
- a needle actuator connected to the needle to move the needle to a die transfer position at which the needle presses on the second side of the wafer tape to press the semiconductor device die into contact with the circuit trace;
- and
- a dampener arranged with the needle and the needle actuator, the dampener dampening a force applied to the semiconductor device die when the needle presses the semiconductor device die into contact with the circuit trace.
An apparatus comprising:
- a needle having a first end opposite a second end;
- a needle actuator to move the needle to a position at which the second end of the needle presses an electrically-actuatable element into contact with a circuit trace;
- and
- a dampener arranged with the first end of the needle and an end of the needle actuator, the dampener dampening a force applied to the electrically-actuatable element when the second end of the needle presses the electrically-actuatable element into contact with the circuit trace.
Dependencies are inferred from the claim text.