Transferring apparatus and method for manufacturing an integrated circuit device

A method of manufacturing an integrated circuit device using a transferring apparatus,

• wherein the transferring apparatus comprises:
• a rail connected to a frame;
• a travelling part including a wheel that travels along the rail and a loading part for loading an object;
• and
• a particle collecting part, provided at a side of the rail, for collecting particles generated due to friction between the wheel and the rail when the wheel travels along the rail, the method including:
• moving the travelling part to the object;
• picking up the object with the loading part thereby loading the object on the loading part;
• using the travelling part to move the object to a chamber;
• collecting particles in the particle collecting part;
• and
• forming a semiconductor device using the object.

A method of manufacturing an integrated circuit device using a transferring apparatus,

• wherein the transferring apparatus comprises:
• a rail connected to a frame;
• and
• a transport vehicle including a wheel that travels along the rail, the transport vehicle used to move an object;
• a particle collection receptacle provided at a side of the rail and configured to collect particles generated due to friction between the wheel and the rail when the wheel travels along the rail, the method including:
• moving the transport vehicle toward the object;
• picking up the object;
• using the transport vehicle to move the object to a chamber;
• collecting particles in the particle collection receptacle;
• performing a process on a wafer in the chamber using the object;
• and
• forming the integrated circuit device from the processed wafer.