Substrate support apparatus, substrate treating system including the same, and substrate treating method

A method for treating a substrate, the method comprising:

• seating the substrate on a support plate;
• and
• heating the substrate by using a conduction heat through the support plate, by a heating member installed in the support plate,
• wherein the support plate has a buffer area having a buffer space for restricting a heat transfer rate of the conduction heat such that a temperature gradient is generated between a plurality of areas of the substrate.

A substrate treating system comprising:

• an application device configured to form a photoresist film on a substrate;
• and
• a heating device configured to heat the photoresist film formed on the substrate,
• wherein the heating device includes:
• a process chamber having a treatment space for treating the substrate in the interior thereof;
• and
• a substrate support apparatus configured to support the substrate in the treatment space,
• wherein the substrate support apparatus includes:
• a substrate support member including a support plate having an upper surface;
• and
• a heating member provided in the support plate to heat the substrate, and
• wherein an area of the support plate has a buffer area, in which a buffer space for restricting a heat transfer rate of heat provided from the hearing member to the upper surface is formed.