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US 2018/0122653 A1Published application
Semiconductor structure
AssigneeNanya Technology Corporation
InventorPo Chun LIN
Life of this patent
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Abstract
A semiconductor structure includes a substrate; a chip disposed over the substrate; and a molding disposed over the substrate and surrounding the chip at a molding temperature. The warpage of the substrate is convex or about zero at the molding temperature or 10° C. more or less than the molding temperature.
Claims2
A semiconductor structure, comprising:
- a substrate;
- a chip disposed over the substrate;
- and
- a molding disposed over the substrate and surrounding the chip at a molding temperature, wherein the warpage of the substrate is convex or about zero at the molding temperature or 10° C. more or less than the molding temperature.
1 more element
Dependencies are inferred from the claim text.