Carrier Plate for Use in Plasma Processing Systems
AssigneeLam Research Corporation
InventorKarl Leeser
Life of this patent
Estimating the term…
Abstract
A carrier plate for receiving a wafer includes a pocket defined in a middle section on a top surface of the carrier plate and has a surface diameter. The pocket defines a substrate support region. A retaining feature of the carrier plate is defined at an outer edge of the pocket. A tapered portion of the carrier plate extends from the retaining feature to an outer diameter. The tapered portion is configured to receive a focus ring. A bottom surface of the carrier plate is configured to sit over a pedestal that is used in a process chamber. A plurality of wafer supports is disposed on a top surface of the substrate support region to support the wafer, when received.
Claims27
A process chamber for processing a wafer, comprising:
- a pedestal configured to support a carrier plate, a top surface of the pedestal extends to at least an outer diameter;
- the carrier plate configured to be disposed on the pedestal, the carrier plate includes a pocket defined in a middle section on a top surface of the carrier plate so as to cover at least the surface diameter, a retaining feature disposed adjacent to an outer edge of the pocket, and a tapered portion extending from the retaining feature to the outer diameter of the pedestal, the pocket defines a substrate support region to support a wafer, when received;
- and
- a plurality of carrier supports distributed along the top surface of the pedestal, the plurality of carrier supports define minimum contact areas offering reliable support for the carrier plate, when received.
A carrier plate for receiving a wafer, comprising:
- a pocket defined in a middle section on a top surface of the carrier plate and has a surface diameter, the pocket defines a substrate support region;
- a retaining feature of the carrier plate defined at an outer edge of the pocket;
- a tapered portion of the carrier plate extending from the retaining feature to an outer diameter, the tapered portion configured to receive a focus ring;
- a bottom surface of the carrier plate is configured to be received over a pedestal that is used in a process chamber;
- and
- a plurality of wafer supports disposed on a top surface of the substrate support region to support the wafer, when received.
Dependencies are inferred from the claim text.