Wound capacitor package structure without negative conductive foil and wound assembly thereof

A wound capacitor package structure without negative conductive foil, comprising:

• a wound assembly including a wound positive conductive foil and a wound separator paper mated with the wound positive conductive foil, wherein the wound separator paper has a plurality of conductive materials disposed therein;
• a package assembly for enclosing the wound assembly;
• and
• a conductive assembly including a first conductive pin electrically contacting the wound positive conductive foil and a second conductive pin electrically contacting the wound separator paper.

A wound assembly without negative conductive foil, the wound assembly electrically mated with a conductive assembly, the wound assembly comprising:

• a wound positive conductive foil;
• and
• a wound separator paper mated with the wound positive conductive foil, wherein the wound separator paper has a plurality of conductive materials disposed therein;
• wherein the conductive assembly including a first conductive pin electrically contacting the wound positive conductive foil and a second conductive pin electrically contacting the wound separator paper, wherein the wound positive conductive foil and the wound separator paper are wound together to form the wound assembly.