Multilayer electronic component and method of manufacturing the same

A method of manufacturing a multilayer electronic component, the method comprising:

• forming first and second ceramic green sheets using a slurry containing a powder having a dielectric property, a binder, and a solvent;
• printing a first internal electrode base pattern on one surface of the first ceramic green sheet;
• printing a second internal electrode base pattern on one surface of the second ceramic green sheet such that a margin region of the second ceramic green sheet remains free of the second internal electrode base pattern, wherein the margin region includes two end portion regions of the second ceramic green sheet opposite to each other in a width direction of the second ceramic green sheet and at least a partial region between the two end portion regions of the second ceramic green sheet, and the second internal electrode base pattern is different from the first internal electrode base pattern;
• stacking the first ceramic green sheet including the first internal electrode base pattern and the second ceramic green sheet including the second internal electrode base pattern in a thickness direction to form a multilayer bar;
• cutting the multilayer bar in which the first and second ceramic green sheets are stacked to form bodies including a multilayer structure in which first and second internal electrode patterns are stacked and containing a dielectric material;
• disposing first and second side parts on a first pair of opposing outer surfaces of each body of the bodies formed by the cutting;
• and
• disposing first and second external electrodes on a second pair of opposing outer surfaces of each body.

A multilayer electronic component comprising:

• a multilayer structure in which pluralities of first internal electrode patterns and second internal electrode patterns different from the first internal electrode patterns are alternately stacked and containing a dielectric material;
• and
• first and second side parts and first and second external electrodes disposed on respective outer surfaces of the multilayer structure,
• wherein each of the plurality of first internal electrode patterns extends to at least three outer surfaces of the multilayer structure, and each of the plurality of second internal electrode patterns extends to only one outer surface of the multilayer structure.

A multilayer electronic component comprising:

• a ceramic body including a dielectric material and pluralities of first internal electrode patterns and second internal electrode patterns different from the first internal electrode patterns alternately stacked in the dielectric material, the ceramic body having four side surfaces and a bottom surface and a top surface;
• first and second side parts disposed on two opposing side surfaces of the ceramic body among the four side surfaces;
• and
• first and second external electrodes disposed on the two remaining opposing side surfaces of the ceramic body,
• wherein each of the plurality of first internal electrode patterns extends to the two opposing side surfaces of the ceramic body and only one of the two remaining opposing side surfaces of the ceramic body, and each of the plurality of second internal electrode patterns extends to the other one of the two remaining opposing side surfaces of the ceramic body.