Coil electronic component and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKi Seok KIM, Myung Sam KANG, Ye Jeong KIM, Kwang Hee KWON, Sa Yong LEE
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Abstract
A coil electronic component includes: a plurality of coil layers including, respectively, coil patterns and connection patterns disposed outside the coil patterns and forming a stacking structure; conductive vias connecting the coil patterns formed on different levels to each other; and external electrodes electrically connected to the plurality of coil layers. The coil patterns of at least two of the plurality of coil layers may have the same shape and be electrically connected to each other in parallel.
Claims20
A coil electronic component comprising:
- a plurality of coil layers including, respectively, coil patterns and connection patterns disposed outside the coil patterns and forming a stacking structure;
- conductive vias connecting the coil patterns formed on different levels to each other;
- and
- external electrodes electrically connected to the plurality of coil layers,
- wherein the coil patterns of at least two of the plurality of coil layers have the same shape, and are electrically connected to each other in parallel.
A method of manufacturing a coil electronic component, comprising:
- forming a plurality of unit laminates including coil patterns, connection patterns disposed outside the coil patterns, insulating layers covering the coil patterns, and conductive vias penetrating through the insulating layers and connected to the coil patterns;
- stacking the plurality of unit laminates to correspond to one another;
- and
- forming external electrodes on external surfaces of a stacking structure of the plurality of unit laminates,
- wherein the coil patterns of at least two of a plurality of coil layers have the same shape, and are electrically connected to each other in parallel.
Dependencies are inferred from the claim text.