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US 2018/0122556 A1Published application
Coil electronic component and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKi Seok KIM, Ye Jeong KIM, Myung Sam KANG, Kwang Hee KWON
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Abstract
A coil electronic component includes: a plurality of stacked coil layers each including coil patterns including anisotropic plating layers; conductive vias connecting the coil patterns formed on different coil layers to each other; and external electrodes electrically connected to the plurality of coil layers.
Claims17
A coil electronic component comprising:
- a plurality of stacked coil layers, each of the coil layers including coil patterns including anisotropic plating layers;
- conductive vias connecting the coil patterns formed on different coil layers to each other;
- and
- external electrodes electrically connected to the plurality of coil layers.
1 more element
A method of manufacturing a coil electronic component, comprising steps of:
- forming a plurality of unit laminates including coil patterns having anisotropic plating layers, insulating layers covering the coil patterns, and conductive vias penetrating through the insulating layers and connected to the coil patterns;
- stacking the plurality of unit laminates to correspond to one another;
- and
- forming external electrodes on external surfaces of a stacking structure of the plurality of unit laminates.
1 more element
Dependencies are inferred from the claim text.