Inductor and method of manufacturing the same

A method of manufacturing an inductor, comprising:

• forming a coil pattern on a substrate;
• forming an insulating layer on the substrate to cover the coil pattern;
• forming, in the insulating layer, a through-hole having an upper portion having a transverse cross-sectional area that is greater than a transverse cross-sectional area of a lower portion of the through-hole, wherein the lower portion of the through-hole contacts the coil pattern;
• forming a first conductive layer within the through hole, to exceed an upper surface of the insulating layer;
• forming a second conductive layer by printing a conductive paste on an upper portion of the first conductive layer;
• separating the substrate from the insulating layer including the coil pattern and the first and second conductive layers;
• and
• forming a body including a coil composed of a via including the coil pattern and the via comprising the first and second conductive layers connected to the coil pattern by laminating a plurality of the separated insulating layers.

A body comprising:

• first and second conductive patterns disposed in different planes;
• and
• a conductive via extending between and electrically connecting the first and second conductive patterns,
• wherein a contact area of the conductive via with the first conductive pattern is larger than a contact area of the conductive via with the second conductive pattern.

An inductor comprising:

• a body formed of an insulating material;
• a coil disposed in the body, the coil comprising first and second coil patterns connected by a conductive via;
• and
• first and second electrodes disposed on external surfaces of the body and connected to respective ends of the coil,
• wherein:
• the conductive via comprises a first conductive layer contacting the first coil pattern and a second conductive layer disposed on an arced surface of the first conductive layer and contacting the second coil pattern,
• the first and second conductive layers have different compositions, and
• the conductive via comprising the first and second conductive layers has a tapered profile gradually expanding between a small cross sectional area of the first conductive layer contacting the first coil pattern and a larger cross sectional area of the second conductive layer contacting the second coil pattern.