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US 2018/0122536 A1Published application
Chip resistor and mounting structure thereof
AssigneeRohm Co., Ltd.
InventorMasaki YONEDA
Life of this patent
Estimating the term…
Abstract
A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.
Claims11
1-45. (canceled)
A resistor comprising:
- an insulating substrate including a first surface and a second surface, the first surface of the insulating substrate being spaced apart from the second surface of the insulating substrate in a thickness direction of the insulating substrate;
- a bonding layer including a first surface and a second surface, the first surface of the bonding layer being spaced apart from the second surface of the bonding layer in the thickness direction of the insulating substrate, the first surface of the bonding layer facing the insulating substrate side, the first surface of the bonding layer being held in contact with at least a part of the second surface of the insulating layer;
- a resistive element including a first surface and a second surface, the first surface of the resistive element being spaced apart from the second surface of the resistive element, the first surface of the resistive element being held in contact with the second surface of the bonding layer;
- a first electrode electrically connected to the resistive element;
- and
- a second electrode electrically connected to the resistive element, the second electrode and the first electrode being spaced apart from each other in a first direction perpendicular to the thickness direction of the insulating substrate.
3 more elements
Dependencies are inferred from the claim text.