Wired circuit board
AssigneeNitto Denko Corporation
InventorsDaisuke YAMAUCHI, Hiroyuki TANABE
Life of this patent
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Abstract
A wired circuit board includes an insulating layer and a plurality of wires disposed at one-side surface in a thickness direction of the insulating layer at spaced intervals to each other. The plurality of wires have one pair of wires in parallel, the plurality of wires continuously have a first portion and a second portion in which the total sum of a line width of one wire of one pair of wires and an interval between one pair of wires is smaller than that of the first portion, and a thickness T1 of the first portion is large with respect to a thickness T2 of the second portion.
Claims5
A wired circuit board comprising:
- an insulating layer and
- a plurality of wires disposed at one-side surface in a thickness direction of the insulating layer at spaced intervals to each other, wherein
- the plurality of wires have one pair of wires in parallel,
- the plurality of wires continuously have
- a first portion and
- a second portion in which the total sum of a line width of one wire of one pair of wires and an interval between one pair of wires is smaller than that of the first portion, and
- a thickness T1 of the first portion is large with respect to a thickness T2 of the second portion.
Dependencies are inferred from the claim text.