Support frame with integrated phase change material for thermal management
AssigneeFuturewei Technologies, Inc.
InventorQian Han
Life of this patent
Estimating the term…
Abstract
The invention is directed to a novel solution to providing heat management and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. The heat management features include phase changing materials that allow the processing components to be kept at an isothermal state through changes in phase, thereby prolonging the duration of time in which the processing components can operate at high performance levels without the need to throttle the performance
Claims20
A mobile computing device, comprising:
- a front panel;
- a back panel;
- and
- a monolithic mid-frame disposed between the front panel and the back panel, wherein the mid-frame includes a structure of a phase change material, and wherein the mid-frame is configured to provide mechanical support for one or both of the front panel and back panel.
A mobile computing device, comprising:
- a front panel;
- a back panel;
- one or more computer processing components including firmware;
- and
- a monolithic mid-frame disposed between the front panel and the back panel, wherein the mid-frame includes a structure of a phase change material, and wherein the mid-frame is configured to provide mechanical support for the one or more computer processing components, wherein the firmware is configured to throttle a performance level of the one or more computer processing components when the heat generated by the component exceeds a temperature higher than a phase change temperature of the phase change material.
An apparatus of a mobile computing device, the apparatus comprising:
- a monolithic mid-frame including a closed cavity filled with a phase change material, wherein the mid-frame provides mechanical support to one or more components of the mobile computing device;
- and
- a heat spreader positioned within the mid-frame next to the phase change material.
Dependencies are inferred from the claim text.