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US 2018/0118903 A1Published application
Process for Cold Bonding Rubber on Metal Substrates
AssigneeHenkel AG & Co. KGaA
InventorsGiorgio Zaffaroni, Eleonora Salmoiraghi, Manuela Brusa
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Abstract
The present invention relates to a process for cold bonding elastomeric rubber substrates to non-elastomeric substrates of a different material, preferably metal, by use of a rubber treatment, preferably a primer composition and a 2k adhesive, preferably a 2k epoxy adhesive as well as the thus obtained bonded substrates.
Claims18
A process for forming a bond between a first elastomeric rubber substrate and a second metal substrate, comprising:
- providing the elastomeric rubber substrate;
- providing the metal substrate;
- applying an oxidizing rubber treatment and/or a primer composition comprising at least one cyanoacrylate to a to-be-bonded surface of the rubber substrate;
- providing a curable 2K adhesive comprising a resin component and a hardener component;
- mixing the resin component and hardener component to form a mixed 2K adhesive composition;
- applying the mixed 2K adhesive composition to a to-be-bonded surface of the metal substrate and allowing the applied 2K adhesive composition to develop green strength;
- contacting the primed surface of the rubber substrate and the applied adhesive on the surface of the metal substrate to form the bond.
4 more elements
Dependencies are inferred from the claim text.