Copper oxide powder for use in plating of a substrate, method of plating a substrate using the copper oxide powder, and method of managing plating solution using the copper oxide powder
AssigneeEbara Corporation
InventorsMasashi SHIMOYAMA, Jumpei FUJIKATA, Fumitoshi NISHIURA, Takashi KISHI
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Abstract
Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate.
Claims9
A copper oxide powder to be supplied into a plating solution for plating a substrate, comprising:
- copper;
- and
- impurities including sodium, a concentration of the sodium being not more than 20 ppm.
A method of plating a substrate, comprising:
- supplying copper oxide powder into a plating solution, the copper oxide powder containing copper and impurities including sodium, a concentration of the sodium being not more than 20 ppm;
- and
- applying a voltage between an insoluble anode and a substrate immersed in the plating solution to plate the substrate.
A method of managing a plating solution for use in a plating apparatus having an insoluble anode, comprising:
- supplying copper oxide powder into a plating solution such that a copper ion concentration in the plating solution held in a plating tank is kept within a predetermined management range, the copper oxide powder containing copper and impurities including sodium, a concentration of the sodium being not more than 20 ppm.
The method according 7, wherein a total of concentrations of the impurities is not more than 50 ppm.
Dependencies are inferred from the claim text.