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US 2018/0086631 A1Published application
Cavity forming method for a sensor chip, manufacturing method thereof, chip and electronics apparatus
AssigneeGoertek Inc.
InventorsMengjin Cai, Qinglin Song
Life of this patent
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Abstract
A method for forming a cavity of a sensor chip. The method comprises forming a first groove (a2) on a substrate (a1); bonding a covering layer (a4) onto the substrate (a1) to cover the first groove (a2), thereby forming a cavity; and etching the covering layer (a4) to decrease a thickness of the covering layer. The method can implement a thinner thickness of a film, thereby improving the sensitivity of a sensor.
Claims11
A method for forming a cavity in a MEMS pressure sensor chip, comprising:
- forming a first groove in a substrate;
- bonding a covering layer onto the substrate to cover the first groove, so as to form a cavity;
- and
- etching the covering layer to lower the thickness of the covering layer.
1 more element
(canceled)
Dependencies are inferred from the claim text.