Method of making a tantalum sputter target and sputter targets made thereby
AssigneeTosoh SMD, Inc.
InventorsEugene Y. Ivanov, Matthew Fisher, Alex Kuhn
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Abstract
Methods for making Ta sputter targets and sputter targets made thereby. Ta ingots are compressed along at least two of the x, y, and z dimensions and then cross rolled in at least one of those dimensions. A pair of target blanks is then cut from the cross rolled ingot. The resulting targets have a predominate mix of {100} and {111} textures and have reduced B {100} and B {111} banding factors.
Claims20
A method of making a BCC metal or BCC metal alloy target comprising the steps of
- a) providing an ingot, said ingot having a generally cylindrical configuration and having an x, y and z dimensional direction,
- (b) compressing said ingot in at least two of said dimensional directions,
- (c) cross rolling said ingot along at least one of said dimensional directions,
- (d) cutting said ingot resulting from said step (c) perpendicular to a first of said dimensional directions and parallel to a second said dimensional directions to form at least a pair of target blanks, and
- (e) cross rolling each of said target blanks.
Sputter target comprising Ta metal or Ta metal alloy, said target having a thickness dimension and having a purity of at least 99.5% and a combined C, O, N, H content of less than about 25 ppm, said Ta metal or Ta metal alloy having a grain size of from about 50 to 150 microns and mixed texture with no banding throughout the mid-fraction of said thickness dimension.
Dependencies are inferred from the claim text.