Method for manufacturing a printed circuit board, printed circuit board and rear view device
AssigneeSMR Patents S.à.r.l.
InventorAndreas Herrmann
Life of this patent
Estimating the term…
Abstract
A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.
Claims51
A method of manufacturing a printed circuit board, comprising:
- manufacturing a plurality of plastic substrate parts in an injection molding process to form one or more first substrate parts each comprising at least one coupling means and one or more second substrate parts each comprising at least one receiving means to receive the coupling means;
- selecting and connecting at least two of the substrate parts through the at least one coupling means and the at least one receiving means;
- and
- providing the connected substrate parts with a circuit.
A printed circuit board, comprising:
- a plurality of plastic substrate parts comprising
- one or more first substrate parts each comprising at least one coupling means;
- and
- one or more second substrate parts each comprising at least one receiving means to receive the coupling means,
- wherein at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means, and the connected substrate parts comprise a circuit.
Dependencies are inferred from the claim text.