Variable pin fin construction to facilitate compliant cold plates
AssigneeInternational Business Machines Corporation
InventorMark Delorman Schultz
Life of this patent
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Abstract
A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.
Claims20
An apparatus, comprising:
- a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises:
- a first active region comprising first pin portions positioned in a first planar arrangement;
- and
- a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement;
- and
- a conformable layer adjacent to at least one of the plurality of layers.
An apparatus, comprising:
- a plurality of layers adapted to couple to a load or heat source, wherein the plurality of layers are bonded in a stacked configuration and comprise:
- a first active region comprising first pin portions positioned in a first planar arrangement;
- a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement;
- and
- a conformable layer adjacent to one or more of the plurality of layers.
A method comprising:
- providing a plurality of layers comprising a plurality of respective pin portions, wherein the providing the plurality of layers comprises:
- configuring a first plurality of pin portions of a first layer, of the plurality of layers, according to a first configuration;
- and
- configuring a second plurality of pin portions of a second layer, of the plurality of layers, according to a second configuration;
- aligning the first plurality of pin portions adjacent to the second plurality of pin portions;
- stacking the plurality of layers according to the aligning, resulting in adjacent layers;
- and
- bonding the pin portions of the adjacent layers and a conformable layer to form a stack of bonded layers, wherein the first plurality of pin portions and the second plurality of pin portions form columns of pin fins.
Dependencies are inferred from the claim text.