Solder processing device
AssigneeAND Co., Ltd.
InventorMitsuo EBISAWA
Life of this patent
Estimating the term…
Abstract
In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).
Claims18
A solder processing device which includes:
- a substantially tubular iron tip that can be heated and that is extended vertically;
- and a solder piece supply portion that supplies a solder piece from above into the iron tip, and in which heat of the iron tip is used to melt the solder piece such that the molten solder is supplied downward,
- wherein within the iron tip, a reception portion is provided which receives the supplied solder piece, and
- in a state where the solder piece is held so as to be erected on the reception portion, the supplied solder piece is forcefully brought into contact with an inner wall of the iron tip and melted.
(canceled)
The solder processing device according to claim ,
- wherein the reception portion is a substantially rod-shaped member which passes through the inner wall of the iron tip.
(canceled)
(canceled)
(canceled)
A solder processing device which includes:
- a substantially tubular iron tip that can be heated and that is extended vertically;
- and a solder piece supply portion that supplies a solder piece from above into the iron tip, and in which heat of the iron tip is used to melt the solder piece such that the molten solder is supplied downward, and a terminal protruded upward is soldered to a board,
- wherein in a state where a tip end of the terminal enters the iron tip from below, the supply is performed such that the solder piece is erected on the tip end of the terminal and
- the solder piece supply portion obliquely cuts a wire solder so as to produce the solder piece,
- thereby the erected solder piece is inclined so as to make contact with the inner wall of the iron tip.
A solder processing device which includes:
- a substantially tubular iron tip that can be heated and that is extended vertically;
- and a solder piece supply portion that supplies a solder piece from above into the iron tip, and in which heat of the iron tip is used to melt the solder piece such that the molten solder is supplied downward, and a terminal protruded upward is soldered to a board,
- wherein in a state where a tip end of the terminal enters the iron tip from below, the supply is performed such that the solder piece is erected on the tip end of the terminal and
- the inner wall of the iron tip is extended so as to be inclined with respect to an up/down direction such that the solder piece makes contact with the inner wall of the iron tip.
Dependencies are inferred from the claim text.