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US 2018/0059759 A1Published application
Semiconductor package
AssigneeRohm Co., Ltd.
InventorKiyotaka UMEMOTO
Life of this patent
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Abstract
A semiconductor package includes a plurality of chips, which include a plurality of corresponding functional blocks having the same function among the chips, and only one of the corresponding functional blocks having the same function among the chips enables function, and one or more functional blocks enable function in each of the chips, so that the functional blocks are distributed among the chips.
Claims20
A semiconductor package comprising a plurality of chips, wherein
- the plurality of chips include a plurality of corresponding functional blocks having the same function among the chips, and
- only one of the corresponding functional blocks having the same function among the chips enables function, and one or more functional blocks enable function in each of the chips so that the functional blocks are distributed among the chips.
A semiconductor package comprising:
- one or more functional blocks;
- a magnetic field detecting unit arranged to detect a magnetic field;
- and
- a protection unit arranged to protect at least one of the functional blocks when the magnetic field detecting unit detects a magnetic field.
1 more element
Dependencies are inferred from the claim text.