Apparatus for High-Speed Imaging Sensor Data Transfer

An imaging sensor array, comprising:

• one or more optical elements configured to at least one of reflect or scatter light;
• a first imaging sensor assembly, comprising:
• at least one substrate, wherein the at least one substrate includes a plurality of substrate signal lines;
• and
• at least one imaging sensor package disposed on the at least one substrate, wherein the at least one imaging sensor package includes at least one imaging sensor disposed on at least one imaging sensor package substrate,
• wherein the at least one imaging sensor package is arranged to receive at least a portion of the light from the optical element via the at least one imaging sensor,
• wherein the at least one imaging sensor package converts the received at least a portion of the light from the optical element into a first plurality of data signals;
• at least a second imaging sensor assembly, comprising:
• at least one substrate, wherein the at least one substrate includes a plurality of substrate signal lines;
• and
• at least one imaging sensor package disposed on at least one substrate, wherein the at least one imaging sensor package includes at least one imaging sensor disposed on at least one imaging sensor package substrate, wherein the at least one imaging sensor package is disposed on the at least one substrate,
• wherein the at least one imaging sensor package is arranged to receive at least a portion of the light from the one or more optical elements via the at least one imaging sensor,
• wherein the at least one imaging sensor package converts the received at least a portion of the light from the optical element into at least a second plurality of data signals;
• and
• at least one electrical interconnect, wherein the at least one electrical interconnect is operably coupled to the first imaging sensor assembly and the at least a second imaging sensor assembly.

A high-speed inspection system, comprising:

• an illumination source configured to generate a first beam of illumination;
• a set of focusing optics configured to direct the first beam of illumination onto a surface of a sample, wherein the sample is secured on a sample stage;
• at least one detector configured to detect a second beam of illumination reflected or scattered from the surface of the sample in response to at least a portion of the first beam of illumination, wherein the at least one detector includes at least one imaging sensor assembly comprising:
• at least one substrate, wherein the at least one substrate includes a plurality of substrate signal lines;
• at least one imaging sensor package disposed on the at least one substrate, wherein the at least one imaging sensor package includes at least one imaging sensor disposed on at least one imaging sensor package substrate;
• at least one receiver package disposed on the at least one substrate, wherein the receiver package includes at least one receiver integrated circuit disposed on at least one receiver package substrate;
• and
• at least one electrical interconnect, wherein the at least one electrical interconnect is operably coupled to the at least one imaging sensor package and the at least one receiver package, wherein a plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect;
• and
• a set of collection optics configured to direct the second beam of illumination reflected or scattered from the surface of the sample to the at least one detector.