Heat exchanger puck
AssigneeIntel Corporation
InventorsAARON P. ANDERSON, JOSEPH A. BRODERICK, BARRETT M. FANEUF, ERIC D. MCAFEE, BRIAN S. JARRETT, JUAN G. CEVALLOS, PEI-FANG SUNG, EMERY E. FREY
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AssigneeIntel Corporation
InventorsAARON P. ANDERSON, JOSEPH A. BRODERICK, BARRETT M. FANEUF, ERIC D. MCAFEE, BRIAN S. JARRETT, JUAN G. CEVALLOS, PEI-FANG SUNG, EMERY E. FREY
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Apparatuses and methods associated with heat exchanger puck design are disclosed herein. In embodiments, a heat exchanger puck may include a first plate with a cavity that extends into the first plate from a side of the first plate and a second plate. The second plate may be coupled to the side of the first plate, with the cavity located between the first plate and the second plate. The heat exchanger puck may further include a tube of a liquid coolant system located, at least partially, within the cavity, the tube formed to fit the cavity created by the first plate and the second plate. Other embodiments may be described and/or claimed.
A heat exchanger puck, comprising:
A liquid coolant system, comprising:
A method of manufacturing a heat exchanger puck, comprising:
A method of manufacturing a heat exchanger puck, comprising:
Dependencies are inferred from the claim text.