Method for producing a printed circuit board
AssigneeNextGin Technology BV
InventorJ.A.A.M. Tourne
Life of this patent
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Abstract
A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.
Claims14
A method for producing a printed circuit board, comprising the steps of:
- forming a slot in a substrate having at least three layers with the slot extending through at least two of the layers, the slot having a length and a width with the length being greater than the width;
- coating a sidewall of the substrate surrounding the slot with a conductive layer;
- separating the conductive layer into at least two segments that are electrically isolated along the side wall of the substrate.
A method for producing a printed circuit board, comprising the steps of:
- forming a plurality of adjacently positioned and spaced apart vertical conductive structures, having a length greater than a width, within a substrate having at least three layers with the vertical conductive structures extending through at least two of the layers such that a routing portion of the substrate above or below the vertical conductive structures is devoid of the vertical conductive structures;
- and
- connecting at least one conductive element of one of the vertical conductive structures to a trace extending within the routing portion of the substrate.
A method for producing a printed circuit board, comprising the steps of:
- forming a combination of at least a first stepped blind vertical conductive structure and a second stepped blind vertical conductive structure in a substrate having at least three layers, the substrate having a first side and an opposed second side, the first stepped vertical conductive structure descending from the first side of the substrate, and the second stepped vertical conductive structure descending from the second side of the substrate such that the first and second stepped vertical conductive structures are opposite and aligned, the first stepped blind vertical conductive structure including a plurality of isolated first conductive segments with at least one first conductive segment having a first length and another first conductive segment having a second length greater than the first length, and the second stepped blind vertical conductive structure including a plurality of isolated second conductive segments with at least one of the second conductive segments having a third length and another second conductive segment having a fourth length greater than the third length;
- and wherein the first conductive segment having the first length is positioned adjacent to and opposite of the second conductive segment having the fourth length.
Dependencies are inferred from the claim text.