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US 2018/0052058 A1Published application
Non-contact temperature sensing apparatus
AssigneeLattron Co. Ltd.
InventorsWonKyoung LEE, ChungKook LEE
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Abstract
Disclosed is a non-contact temperature sensing apparatus. The non-contact temperature sensing apparatus includes a substrate connected to one end portion of a lead frame; the lead frame extended to an upper portion of the substrate; an element for sensing temperature attached to the other end portion of the lead frame; and an element for compensating temperature attached to a lower surface of the substrate, wherein the element for sensing temperature is separated from the substrate, thereby increasing a thermal responsibility.
Claims9
A non-contact temperature sensing apparatus comprising:
- a substrate having wiring circuits and connected to one end portion of a lead frame;
- the lead frame extended to an upper portion of the substrate;
- an element for sensing temperature attached to the other end portion of the lead frame;
- an element for compensating temperature attached to a lower surface of the substrate;
- and
- a case for housing the substrate, the element for sensing temperature, and the element for compensating temperature and accommodating a radiant heat flowed therein,
- wherein the element for sensing temperature is separated from the substrate, whereby increasing a thermal responsibility.
4 more elements
Dependencies are inferred from the claim text.