Back to results
US 2018/0044467 A1Published application
Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Prepared Using the Same
AssigneeTaiwan Union Technology Corporation
InventorsGuan-Syun Tseng, Ju-Ming Huang, Tsung-Hsien Lin, Chang-Chien Yang, Chih-Wei Liao
Life of this patent
Estimating the term…
Abstract
A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
Claims20
A resin composition, comprising:
- (A) an epoxy resin;
- and
- (B) a first hardener of formula (I):
- wherein, Ar is an aromatic group, and the —O—Ar—O— is a residue derived from a diphenol;
- R is a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C3 to C20 cycloalkyl group, or a C6 to C20 aryl group;
- and n is an integer from 1 to 20, and
- wherein, the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener is from about 1:0.4 to about 1:1.6.
4 more elements
Dependencies are inferred from the claim text.