Back to results
US 2018/0042118 A1Published application
Chip part and manufacturing method thereof
AssigneeRohm Co., Ltd.
InventorsYasuhiro KONDO, Katsuya MATSUURA, Hiroshi TAMAGAWA
Life of this patent
Estimating the term…
Abstract
A chip part includes a substrate having a first main surface on one side thereof and a second main surface on the other side thereof, a functional device famed at a first main surface side of the substrate, an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device, and a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate.
Claims18
A chip part comprising:
- a substrate having a first main surface on one side thereof and a second main surface on the other side thereof;
- a functional device formed at a first main surface side of the substrate;
- an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device;
- and
- a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate.
2 more elements
A manufacturing method of a chip part comprising:
- a step of preparing a substrate including a first main surface on one side thereof and a second main surface on the other side thereof and having a functional device formed at a first main surface side thereof;
- and
- a step of roughening the second main surface of the substrate.
Dependencies are inferred from the claim text.