# US 2018/0027694 A1 · Electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0027694 A1 - Document ID: US20180027694A1 - Status: Published application - Kind: A1 - Application number: 15/634,844 - Filed: 2017-06-27 - Published: 2018-01-25 - Earliest claimed: 2016-07-21 - Assignees: Lenovo (Singapore) Pte. Ltd. - Applicants: Lenovo (Singapore) Pte. Ltd. - Inventors: AKINORI UCHINO; TAKUROH KAMIMURA; HAJIME YOSHIZAWA; SHUSAKU TOMIZAWA - Web page: https://patentgrep.com/patent/US20180027694A1 ## CPC - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - G06F 1/203: {for portable computers, e.g. for laptops} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract An electronic apparatus which can achieve both a reduction in thickness of a chassis and an improvement in a heat releasing performance is provided. An electronic apparatus 10 includes a chassis 12 having an electronic component 18 arranged therein, a heat sink 20 which is provided in the chassis 12 and absorbs heat generated from the electronic component 18 when its one surface 20a is arranged to enable conduction of the heat from the electronic component 18, and a heat conducting sheet 22 which is arranged in the chassis 12, closely arranged on the other surface 20c on the side opposite to the one surface 20a of the heat sink, has an outer shape area larger than an outer shape area of the heat sink 20, and extends to the outside of an outer shape of the heat sink 20. ## Claims ### Claim 1 An electronic apparatus comprising: a chassis having an electronic component arranged therein; a heat sink which is provided in the chassis, wherein one surface of the heat sink is arranged to enable conduction of heat from the electronic component so that the heat generated from the electronic component is absorbed by the heat sink; and a first heat conducting sheet which is provided in the chassis wherein the first heat conducting sheet is closely arranged on another surface of the heat sink that is opposite the electronic component, wherein the first heat conducting sheet has an outer shape area larger than an outer shape area of the heat sink, and extends outside of the outer shape area of the heat sink. ### Claim 2 (depends on 1) The electronic apparatus according to claim 1, comprising: a second heat conducting sheet which is closely arranged on the one surface of the heat sink, has an outer shape area larger than the outer shape area of the heat sink, and extends outside of the outer shape area of the heat sink. ### Claim 3 (depends on 2) The electronic apparatus according to claim 2, wherein the outer shape area of the heat sink is larger an outer shape area of the electronic component, and the second heat conducting sheet has a notch portion which avoids the electronic component arranged on the one surface of the heat sink, and is closely arranged on the one surface of the heat sink. ### Claim 4 (depends on 2) The electronic apparatus according to claim 2, wherein the first heat conducting sheet and the second heat conducting sheet each has a heat releasing section wherein their sections extend outside of the outer shape area of the heat sink and join together. ### Claim 5 (depends on 4) The electronic apparatus according to claim 4, wherein the first heat conducting sheet and the second heat conducting sheet are formed by splitting one portion of one heat conducting sheet into two layers along a thickness direction, and another portion of the heat conducting sheet forms the heat releasing section. ### Claim 6 (depends on 4) The electronic apparatus according to claim 4, wherein the heat releasing section is formed by bonding the portions of the first heat conducting sheet with the second heat conducting sheet which extend outside of the heat sink. ### Claim 7 (depends on 4) The electronic apparatus according to claim 4, wherein a battery device is arranged in the chassis, and the heat releasing section is arranged on a surface of the battery device. ### Claim 8 (depends on 7) The electronic apparatus according to claim 7, wherein the electronic component is connected to an electronic substrate arranged on a side of the battery device, a wiring line is connected to another electronic component that is different from the electronic component connected to the electronic substrate, and the wiring line is arranged to run through a position which is on a surface of the battery device which does not overlap the heat releasing section. ### Claim 9 (depends on 1) The electronic apparatus according to claim 1, wherein a battery device is arranged in the chassis, and the portion of the first heat conducting sheet which extends outside of the outer shape of the heat sink is arranged on a surface of the battery device.