# US 2018/0027682 A1 · Thermally Efficient Compute Resource Apparatuses and Methods

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- Number: US 2018/0027682 A1
- Document ID: US20180027682A1
- Status: Published application
- Kind: A1
- Application number: 15/423,467
- Filed: 2017-02-02
- Published: 2018-01-25
- Earliest claimed: 2016-07-22
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: MATTHEW J. ADILETTA; AARON GORIUS; MYLES WILDE; MICHAEL T. CROCKER
- Web page: https://patentgrep.com/patent/US20180027682A1

## CPC

- G06F 3/061: {Improving I/O performance}
- G02B 6/3882: {using rods, pins or balls to align a pair of ferrule ends}
- G02B 6/3893: {Push-pull type, e.g. snap-in, push-on}
- G02B 6/3897: {Connectors fixed to housings, casing, frames or circuit boards (G02B6/44528 takes precedence)}
- G02B 6/4292: {the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements}
- G06F 1/183: Internal mounting support structures, e.g. for supporting printed circuit boards
- G06F 1/20: Cooling means
- G06F 3/0613: {in relation to throughput}
- G06F 3/0625: {Power saving in storage systems}
- G06F 3/064: {Management of blocks}
- G06F 3/065: {Replication mechanisms}
- G06F 3/0653: {Monitoring storage devices or systems}
- G06F 3/0655: {Vertical data movement, i.e. input-output transfer; data movement between one or more hosts and one or more storage devices}
- G06F 3/0664: {at device level, e.g. emulation of a storage device or system}
- G06F 3/0665: {at area level, e.g. provisioning of virtual or logical volumes}
- G06F 3/0673: {Single storage device}
- G06F 3/0679: {Non-volatile semiconductor memory device, e.g. flash memory, one time programmable memory [OTP]}
- G06F 3/0683: {Plurality of storage devices}
- G06F 3/0688: {Non-volatile semiconductor memory arrays}
- G06F 3/0689: {Disk arrays, e.g. RAID, JBOD}
- G06F 8/65: Updates (security arrangements therefor G06F21/57)
- G06F 9/30036: {Instructions to perform operations on packed data, e.g. vector, tile or matrix operations}
- G06F 9/4401: Bootstrapping (security arrangements therefor G06F21/57)
- G06F 9/4881: {Scheduling strategies for dispatcher, e.g. round robin, multi-level priority queues}
- G06F 9/5027: {the resource being a machine, e.g. CPUs, Servers, Terminals}
- G06F 9/544: {Buffers; Shared memory; Pipes}
- G06F 12/109: for multiple virtual address spaces, e.g. segmentation (G06F12/1036 takes precedence)
- G06F 12/1408: {by using cryptography (for digital transmission H04L9/00)}
- G06F 13/1668: {Details of memory controller}
- G06F 13/385: {for adaptation of a particular data processing system to different peripheral devices}
- G06F 13/4022: {using switching circuits, e.g. switching matrix, connection or expansion network (G06F13/4009 takes precedence)}
- G06F 13/4068: {Electrical coupling}
- G06F 13/409: {Mechanical coupling (back panels H05K7/1438)}
- G06F 15/161: {Computing infrastructure, e.g. computer clusters, blade chassis or hardware partitioning (casings, cabinets, racks or drawers for data centers H05K5/00)}
- G06F 16/1748: {De-duplication implemented within the file system, e.g. based on file segments (de-duplication techniques in storage systems for the management of data blocks G06F3/0641)}
- G06F 16/9014: {hash tables}
- G08C 17/02: using a radio link
- G11C 5/02: Disposition of storage elements, e.g. in the form of a matrix array
- G11C 7/1072: {for memories with random access ports synchronised on clock signal pulse trains, e.g. synchronous memories, self timed memories}
- G11C 11/56: using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C 14/0009: {in which the volatile element is a DRAM cell}
- H03M 7/3084: {using adaptive string matching, e.g. the Lempel-Ziv method}
- H03M 7/3086: {employing a sliding window, e.g. LZ77}
- H03M 7/4056: {Coding table selection}
- H03M 7/4081: {Static prefix coding}
- H04B 10/25891: {Transmission components (H04B10/40 takes precedence)}
- H04L 41/145: {involving simulating, designing, planning or modelling of a network}
- H04L 43/0817: by checking functioning
- H04L 43/0876: Network utilisation, e.g. volume of load or congestion level
- H04L 43/0894: Packet rate
- H04L 47/83: based on usage prediction
- H04L 49/00: Packet switching elements
- H04L 49/25: Routing or path finding in a switch fabric
- H04L 49/35: Switches specially adapted for specific applications
- H04L 49/357: {Fibre channel switches}
- H04L 49/45: Arrangements for providing or supporting expansion
- H04L 67/02: based on web technology, e.g. hypertext transfer protocol [HTTP]
- H04L 67/306: User profiles
- H04L 69/04: Protocols for data compression, e.g. ROHC
- H04L 69/329: in the application layer [OSI layer 7]
- H04Q 1/09: {Frames or mounting racks not otherwise provided for}
- H04Q 11/0003: {Details}
- H05K 7/1442: {with a radial structure}
- B25J 15/0014: {having fork, comb or plate shaped means for engaging the lower surface on a object to be transported}
- B65G 1/0492: {with cars adapted to travel in storage aisles}
- G05D 23/1921: {using a thermal motor}
- G05D 23/2039: {using mechanical means}
- G06F 3/0611: {in relation to response time}
- G06F 3/0616: {in relation to life time, e.g. increasing Mean Time Between Failures [MTBF]}
- G06F 3/0619: {in relation to data integrity, e.g. data losses, bit errors}
- G06F 3/0631: {by allocating resources to storage systems}
- G06F 3/0638: {Organizing or formatting or addressing of data}
- G06F 3/0647: {Migration mechanisms}
- G06F 3/0658: {Controller construction arrangements}
- G06F 3/0659: {Command handling arrangements, e.g. command buffers, queues, command scheduling}
- G06F 3/067: {Distributed or networked storage systems, e.g. storage area networks [SAN], network attached storage [NAS]}
- G06F 9/3887: {controlled by a single instruction for multiple data lanes [SIMD]}
- G06F 9/5016: {the resource being the memory}
- G06F 9/5044: {considering hardware capabilities}
- G06F 9/505: {considering the load}
- G06F 9/5072: {Grid computing}
- G06F 9/5077: {Logical partitioning of resources; Management or configuration of virtualized resources (specific details on emulation or internal functioning of virtual machines G06F9/455)}
- G06F 11/141: {for bus or memory accesses}
- G06F 11/3414: {Workload generation, e.g. scripts, playback}
- G06F 12/0862: with prefetch
- G06F 12/0893: Caches characterised by their organisation or structure
- G06F 12/10: Address translation
- G06F 13/161: {with latency improvement}
- G06F 13/1694: {Configuration of memory controller to different memory types}
- G06F 13/42: Bus transfer protocol, e.g. handshake; Synchronisation
- G06F 13/4282: {on a serial bus, e.g. I2C bus, SPI bus (on daisy chain buses G06F13/4247)}
- G06F 15/8061: {Details on data memory access}
- G06F 2209/483: Multiproc
- G06F 2209/5019: Workload prediction
- G06F 2209/5022: Workload threshold
- G06F 2212/1008: Correctness of operation, e.g. memory ordering
- G06F 2212/1024: Latency reduction
- G06F 2212/1041: Resource optimization
- G06F 2212/1044: Space efficiency improvement
- G06F 2212/152: Virtualized environment, e.g. logically partitioned system
- G06F 2212/202: Non-volatile memory
- G06F 2212/401: Compressed data
- G06F 2212/402: Encrypted data
- G06F 2212/7207: management of metadata or control data
- G06Q 10/06: Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
- G06Q 10/06314: {Calendaring for a resource}
- G06Q 10/087: Inventory or stock management, e.g. order filling, procurement or balancing against orders
- G06Q 10/20: Administration of product repair or maintenance
- G06Q 50/04: Manufacturing
- G07C 5/008: {communicating information to a remotely located station (transmission systems for measured values G08C)}
- G08C 2200/00: Transmission systems for measured values, control or similar signals
- G11C 5/06: Arrangements for interconnecting storage elements electrically, e.g. by wiring
- H03M 7/30: Compression (speech analysis-synthesis for redundancy reduction G10L19/00; for image communication H04N); Expansion; Suppression of unnecessary data, e.g. redundancy reduction
- H03M 7/40: Conversion to or from variable length codes, e.g. Shannon-Fano code, Huffman code, Morse code
- H03M 7/4031: {Fixed length to variable length coding}
- H03M 7/6005: {Decoder aspects}
- H03M 7/6023: {Parallelization}
- H04B 10/25: Arrangements specific to fibre transmission
- H04J 14/00: Optical multiplex systems
- H04L 9/0643: {Hash functions, e.g. MD5, SHA, HMAC or f9 MAC}
- H04L 9/14: using a plurality of keys or algorithms
- H04L 9/3247: {involving digital signatures}
- H04L 9/3263: {involving certificates, e.g. public key certificate [PKC] or attribute certificate [AC]; Public key infrastructure [PKI] arrangements (network architectures or network communication protocols for supporting authentication of entities using certificates in a packet data network H04L63/0823)}
- H04L 12/2809: {indicating that an appliance service is present in a home automation network (monitoring functionality H04L43/0817; discovery or management thereof, e.g. service location protocol [SLP] or web services, H04L67/51)}
- H04L 41/024: {using relational databases for representation of network management data, e.g. managing via structured query language [SQL]}
- H04L 41/046: comprising network management agents or mobile agents therefor
- H04L 41/0813: characterised by the conditions triggering a change of settings
- H04L 41/082: the condition being updates or upgrades of network functionality
- H04L 41/12: Discovery or management of network topologies
- H04L 41/149: for prediction of maintenance
- H04L 41/40: using virtualisation of network functions or resources, e.g. SDN or NFV entities
- H04L 41/5019: Ensuring fulfilment of SLA
- H04L 43/065: related to network devices
- H04L 43/16: Threshold monitoring
- H04L 45/02: Topology update or discovery
- H04L 45/52: Multiprotocol routers
- H04L 47/24: Traffic characterised by specific attributes, e.g. priority or QoS
- H04L 47/38: by adapting coding or compression rate
- H04L 47/765: triggered by the end-points
- H04L 47/782: {Hierarchical allocation of resources, e.g. involving a hierarchy of local and centralised entities}
- H04L 47/805: {QOS or priority aware}
- H04L 47/82: {Miscellaneous aspects}
- H04L 49/15: Interconnection of switching modules
- H04L 49/555: {Error detection}
- H04L 61/00: Network arrangements, protocols or services for addressing or naming
- H04L 67/10: in which an application is distributed across nodes in the network (software deployment G06F8/60; multiprogramming arrangements G06F9/46)
- H04L 67/1004: Server selection for load balancing
- H04L 67/1008: based on parameters of servers, e.g. available memory or workload (monitoring of computer activity G06F11/30)
- H04L 67/1012: based on compliance of requirements or conditions with available server resources
- H04L 67/1014: based on the content of a request
- H04L 67/1029: using data related to the state of servers by a load balancer
- H04L 67/1034: Reaction to server failures by a load balancer
- H04L 67/1097: for distributed storage of data in networks, e.g. transport arrangements for network file system [NFS], storage area networks [SAN] or network attached storage [NAS]
- H04L 67/12: specially adapted for proprietary or special-purpose networking environments, e.g. medical networks, sensor networks, networks in vehicles or remote metering networks
- H04L 67/34: {involving the movement of software or configuration parameters (network booting or remote initial program loading [RIPL] G06F9/4416)}
- H04L 67/51: Discovery or management thereof, e.g. service location protocol [SLP] or web services
- H04Q 1/04: Frames or mounting racks for selector switches; Accessories therefor, e.g. frame cover
- H04Q 11/00: Selecting arrangements for multiplex systems (multiplex systems H04J)
- H04Q 11/0005: {Switch and router aspects}
- H04Q 11/0062: {Network aspects}
- H04Q 11/0071: {Provisions for the electrical-optical layer interface}
- H04Q 2011/0037: {Operation}
- H04Q 2011/0041: {Optical control}
- H04Q 2011/0052: {Interconnection of switches}
- H04Q 2011/0073: {Provisions for forwarding or routing, e.g. lookup tables}
- H04Q 2011/0079: {Operation or maintenance aspects}
- H04Q 2011/0086: {Network resource allocation, dimensioning or optimisation}
- H04Q 2213/13523: bandwidth management, e.g. capacity management
- H04Q 2213/13527: protocols - X.25, TCAP etc.
- H04W 4/023: {using mutual or relative location information between multiple location based services [LBS] targets or of distance thresholds}
- H04W 4/80: Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/181: associated with surface mounted components
- H05K 5/0204: {Mounting supporting structures on the outside of casings}
- H05K 7/1418: {Card guides, e.g. grooves (H05K7/1425 takes precedence)}
- H05K 7/1421: {Drawers for printed circuit boards}
- H05K 7/1422: {Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames}
- H05K 7/1447: {External wirings; Wiring ducts; Laying cables}
- H05K 7/1461: {Slidable card holders; Card stiffeners; Control or display means therefor}
- H05K 7/1485: {Servers; Data center rooms, e.g. 19-inch computer racks}
- H05K 7/1487: {Blade assemblies, e.g. blade cases or inner arrangements within a blade}
- H05K 7/1489: {characterized by the mounting of blades therein, e.g. brackets, rails, trays (H05K7/1491 takes precedence)}
- H05K 7/1491: {having cable management arrangements (management of optical cables G02B6/444; in telecommunication cabinets H04Q1/06)}
- H05K 7/1492: {having electrical distribution arrangements, e.g. power supply or data communications}
- H05K 7/1498: {Resource management, Optimisation arrangements, e.g. configuration, identification, tracking, physical location (thermal management H05K7/20836)}
- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- H05K 7/20709: {for server racks or cabinets; for data centers, e.g. 19-inch computer racks}
- H05K 7/20727: {within server blades for removing heat from heat source}
- H05K 7/20736: {within cabinets for removing heat from server blades}
- H05K 7/20745: {within rooms for removing heat from cabinets, e.g. by air conditioning device}
- H05K 7/20836: {Thermal management, e.g. server temperature control}
- H05K 13/0486: {Replacement and removal of components}
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H05K 2201/10121: Optical component, e.g. opto-electronic component
- H05K 2201/10159: Memory
- H05K 2201/10189: Non-printed connector
- Y02D 10/00: Energy efficient computing, e.g. low power processors, power management or thermal management
- Y02P 90/30: Computing systems specially adapted for manufacturing
- Y04S 10/50: Systems or methods supporting the power network operation or management, involving a certain degree of interaction with the load-side end user applications
- Y04S 10/52: Outage or fault management, e.g. fault detection or location
- Y10S 901/01: Mobile robot
- Y10S 901/30: End effector
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G08C: TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS (fluid pressure transmitting systems F15B; mechanical means for transferring the output of a sensing member into a different variable G01D5/00; mechanical control systems G05G)
- G11C: STATIC STORES (semiconductor memory devices H10B)
- H03M: CODING; DECODING; CODE CONVERSION IN GENERAL (using fluidic means F15C4/00; optical analogue/digital converters G02F7/00; coding, decoding or code conversion, specially adapted for particular applications, see the relevant subclasses, e.g. G01D, G01R, G06F, G06T, G09G, G10L, G11B, G11C, H04B, H04L, H04M, H04N; ciphering or deciphering for cryptography or other purposes involving the need for secrecy G09C)
- H04B: TRANSMISSION
- H04L: TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION (arrangements common to telegraphic and telephonic communication H04M)
- H04Q: SELECTING (switches, relays, selectors H01H; wireless communication networks H04W)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B25J: MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES ({manipulators specially adapted for use in surgery A61B34/70; manipulators used in cleaning hollow articles B08B9/04}; manipulators associated with rolling mills B21B39/20; manipulators associated with forging machines B21J13/10; {manipulators associated with picking-up and placing mechanisms B23P19/007}; means for holding wheels or parts thereof B60B30/00; {vehicles with ground-engaging propulsion means, e.g. walking members B62D57/02, B62D57/032; devices for picking-up and depositing articles or materials between conveyors B65G47/90, B65G47/91; manipulators with gripping or holding means for transferring packages B65H67/065}; cranes B66C; {manipulators used in the protection or supervision of pipe-line installations F17D5/00; walking equipment adapted for nuclear steam-generators F22B37/006}; manipulators specially adapted for, or associated with, nuclear reactors G21C; {apparatus used for handling wafers during manufacture or treatment of semiconductor H10P72/50})
- B65G: TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS (packaging B65B; handling thin or filamentary materials, e.g. paper sheets or thread, B65H; cranes B66C; portable mobile or lifting or hauling appliances, e.g. hoists, B66D; devices for lifting or lowering goods for loading or unloading purposes, e.g. fork-lift trucks, B66F9/00; emptying bottles, jars, casks, barrels or similar containers, not otherwise provided for, B67C9/00; delivering or transferring liquids B67D; filling or discharging vessels for liquefied, solidified or compressed gases F17C; pipe-line systems for fluids F17D)
- G05D: SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G06Q: INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G07C: TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
- H04J: MULTIPLEX COMMUNICATION (transmission in general H04B; peculiar to transmission of digital information H04L5/00; systems for the simultaneous or sequential transmission of more than one television signal H04N7/08; in exchanges H04Q11/00; stereophonic systems H04S)
- H04W: WIRELESS COMMUNICATION NETWORKS (broadcast communication H04H; communication systems using wireless links for non-selective communication, e.g. wireless extensions H04M1/72)
- Y02D: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y04S: SYSTEMS INTEGRATING TECHNOLOGIES RELATED TO POWER NETWORK OPERATION, COMMUNICATION OR INFORMATION TECHNOLOGIES FOR IMPROVING THE ELECTRICAL POWER GENERATION, TRANSMISSION, DISTRIBUTION, MANAGEMENT OR USAGE, i.e. SMART GRIDS
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

## Abstract

Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds can house physical resources and heat sinks thermally coupled to the physical resources. The physical resources are arranged on the sleds and the heat sinks are configured so as to limit thermal shadowing between physical resources to reduce interference with airflow provided by fans of the racks.

## Claims

### Claim 1

A data center sled, comprising:
a substrate having a top surface and a bottom surface;
a first plurality of physical resources disposed on the top surface of the substrate; and
at least one heat sink coupled to the top surface of the substrate and thermally coupled to the first plurality of physical resources, the first plurality of physical resources arranged on the top surface laterally across the top surface of the substrate to reduce thermal shadowing between ones of the first plurality of physical resources.

### Claim 2 (depends on 1)

The data center sled of claim 1, wherein the substrate is a printed circuit board and the at least one heat sink is greater than 1U height.

### Claim 3 (depends on 1)

The data center sled of claim 1, comprising a second plurality of physical resources disposed on the bottom surface of the substrate, the second plurality of physical resources arranged on the bottom surface laterally across the bottom surface to reduce thermal shadowing between ones of the second plurality of physical resources.

### Claim 4 (depends on 3)

The data center sled of claim 3, the second plurality of physical resources comprising a plurality of memory modules, the plurality of memory modules comprising dual in-line memory modules (DIMMs), each of the plurality DIMMs arranged on the bottom surface of the substrate such that ends of each of the DIMMs are positioned perpendicular to a front edge of the top surface of the substrate.

### Claim 5 (depends on 4)

The data center sled of claim 4, the second plurality of physical resources comprising a voltage regulator resource, the voltage regulator resource disposed on the bottom surface of the substrate between a first subset of the plurality of DIMMs and a second subset of the plurality of DIMMs, the first subset of the plurality of DIMMs comprising different DIMMs from the second subset of the plurality of DIMMs.

### Claim 6 (depends on 1)

The data center sled of claim 1, the first plurality of resources comprising a first compute resource and a second compute resource, the at least one heat sink comprising:
a pair of thermal contact plates, a first one of the pair of thermal contact plates thermally coupled to the first compute resource and a second one of the pair of thermal contact plates thermally coupled to the second compute resource;
at least one first post and at least one second post, the at least one first post mechanically and thermally coupled to the first one of the pair of thermal contact plates and the at least one second post mechanically and thermally coupled to the second one of the pair of thermal contact plates; and
a plurality of plates, the plurality of plates disposed in a plane horizontal to the substrate and fixed in a stack extending vertically from the pair of thermal contact plates via the at least one first post and the at least one second posts.

### Claim 7 (depends on 1)

The data center sled of claim 1, the first plurality of resources comprising a first compute resource and a second compute resource, the at least one heat sink comprising, for each of the first compute resource and the second compute resource, a compute heat sink, the compute heat sink comprising:
a plurality of plates thermally coupled to a one of the plurality of resources, the plurality of plates disposed in a plane perpendicular to the substrate; and
a heat sink shell mechanically coupled to the plurality of plates to fix the plurality of plates in a lateral stack across a portion of the substrate.

### Claim 8 (depends on 7)

The data center sled of claim 7, wherein the heat sink shell is thermally coupled to the plurality of plates.

### Claim 9 (depends on 1)

The data center sled of claim 1, the first plurality of resources comprising a first resource and a second resource, the at least one heat sink comprising, for each of the first resource and the second resource, a heat sink, the heat sink comprising:
a thermal contact plate thermally coupled to a one of the plurality of resources;
at least one post mechanically and thermally coupled to the thermal contact plate; and
a plurality of plates, the plurality of plates disposed in a plane horizontal to the substrate and fixed in a stack extending vertically from the thermal contact plate via the at least one post.

### Claim 10 (depends on 9)

The data center sled of claim 9, the first resource and second resource comprising physical accelerator resources or physical compute resources.

### Claim 11 (depends on 9)

The data center sled of claim 9, the first plurality of resources comprising at least one networking resource, the at least one heat sink comprising a networking resource heat sink, the networking resource heat sink comprising a plurality of fins disposed in a plane perpendicular to upper surface of the substrate and a front edge of the substrate.

### Claim 12 (depends on 11)

The data center sled of claim 11, the at least one networking resource disposed between the first resource and the second resource laterally across the sled.

### Claim 13

A heat sink for a plurality of physical resources of a sled of a data center, the heat sink comprising:
a thermal contact plate for each one of a plurality of physical resources, each of the thermal contact plates to thermally coupled to the one of the plurality of physical resources;
at least one post for each one of the plurality of thermal contact plates, the at least one post mechanically and thermally coupled to the one of the plurality of thermal contact plates; and
a plurality of plates, each of the plurality of plates disposed in a parallel planes and fixed in a stack via the at least one posts of each of the plurality of thermal contact plates.

### Claim 14 (depends on 13)

The heat sink of claim 13, the plurality of thermal contact plates comprising aluminum, copper, an aluminum alloy, or a copper alloy.

### Claim 15 (depends on 14)

The heat sink of claim 14, the plurality of plates comprising aluminum, copper, an aluminum alloy, or a copper alloy.

### Claim 16 (depends on 15)

The heat sink of claim 15, the plurality of physical resources comprising physical compute resources.

### Claim 17

A system for a data center comprising:
a rack comprising at least one fan to provide an airflow;
a sled to couple to the rack in a position to receive the airflow, the sled comprising:
a substrate having a top surface and a bottom surface;
a first plurality of physical resources disposed on the top surface of the substrate; and
at least one heat sink coupled to the top surface of the substrate and thermally coupled to the first plurality of physical resources, the first plurality of physical resources arranged on the top surface laterally across the top surface of the substrate to reduce thermal shadowing of the airflow between ones of the first plurality of physical resources, the sled disposed in the rack.

### Claim 18 (depends on 17)

The system of claim 17, comprising a second plurality of physical resources disposed on the bottom surface of the substrate, the second plurality of physical resources arranged on the bottom surface laterally across the bottom surface to reduce thermal shadowing of the airflow between ones of the second plurality of physical resources.

### Claim 19 (depends on 18)

The system of claim 18, the second plurality of physical resources comprising a plurality of memory modules.

### Claim 20 (depends on 19)

The system of claim 19, the plurality of memory modules comprising dual in-line memory modules (DIMMs), each of the plurality DIMMs arranged on the bottom surface of the substrate such that ends of each of the DIMMs are positioned perpendicular to a front edge of the top surface of the substrate.

### Claim 21 (depends on 20)

The system of claim 20, the second plurality of physical resources comprising a voltage regulator resource, the voltage regulator resource disposed on the bottom surface of the substrate between a first subset of the plurality of DIMMs and a second subset of the plurality of DIMMs, the first subset of the plurality of DIMMs comprising different DIMMs from the second subset of the plurality of DIMMs.

### Claim 22 (depends on 17)

The system of claim 17, the first plurality of resources comprising a first compute resource and a second compute resource, the at least one heat sink comprising:
a pair of thermal contact plates, a first one of the pair of thermal contact plates thermally coupled to the first compute resource and a second one of the pair of thermal contact plates thermally coupled to the second compute resource;
at least one first post and at least one second post, the at least one first post mechanically and thermally coupled to the first one of the pair of thermal contact plates and the at least one second post mechanically and thermally coupled to the second one of the pair of thermal contact plates; and
a plurality of plates, the plurality of plates disposed in a plane horizontal to the substrate and fixed in a stack extending vertically from the pair of thermal contact plates via the at least one first post and the at least one second posts.

### Claim 23 (depends on 17)

The system of claim 17, the first plurality of resources comprising a first compute resource and a second compute resource, the at least one heat sink comprising, for each of the first compute resource and the second compute resource, a compute heat sink, the compute heat sink comprising:
a plurality of plates thermally coupled to a one of the plurality of resources, the plurality of plates disposed in a plane perpendicular to the substrate; and
a heat sink shell mechanically coupled to the plurality of plates to fix the plurality of plates in a lateral stack across a portion of the substrate.

### Claim 24 (depends on 23)

The system of claim 23, wherein the heat sink shell is thermally coupled to the plurality of plates.

### Claim 25 (depends on 17)

The system of claim 17, the first plurality of resources comprising a first resource and a second resource, the at least one heat sink comprising, for each of the first resource and the second resource, a heat sink, the heat sink comprising:
a thermal contact plate thermally coupled to a one of the plurality of resources;
at least one post mechanically and thermally coupled to the thermal contact plate; and
a plurality of plates, the plurality of plates disposed in a plane horizontal to the substrate and fixed in a stack extending vertically from the thermal contact plate via the at least one post.