# US 2018/0027668 A1 · Method of manufacturing conductive layer and wiring board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0027668 A1 - Document ID: US20180027668A1 - Status: Published application - Kind: A1 - Application number: 15/541,687 - Filed: 2015-12-17 - Published: 2018-01-25 - Earliest claimed: 2015-01-06 - Assignees: Fujikura Ltd. - Applicants: Fujikura Ltd. - Inventors: Masahiro Kaizu; Masateru Ichikawa - Web page: https://patentgrep.com/patent/US20180027668A1 ## CPC - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H01B 1/22: the conductive material comprising metals or alloys - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 3/10: in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern - H05K 3/12: using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} - H05K 2201/0137: Materials - H05K 2201/0929: Conductive planes - H05K 2201/09609: Via grid, i.e. two-dimensional array of vias or holes in a single plane - H05K 2203/0195: Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure - H05K 2203/0776: Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773 - H05K 2203/1131: Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) ## Abstract A method of manufacturing a conductive layer on a support body includes a first process of forming a precursor layer containing at least one of metal particles and metal oxide particles on the support body; a second process of forming a sintering layer by irradiating an electromagnetic wave pulse on the precursor layer; and a third process of compressing the sintering layer. The conductive layer is formed by repeating the first to third processes “N” times, where “N” denotes a natural number equal to or greater than 2, on the same location of the support body, and the third process performed in the first to (N−1)th operations includes forming a surface of the sintering layer in an uneven shape. ## Claims ### Claim 1 A method of manufacturing a conductive layer on a support body, the method comprising: a first process of forming a precursor layer containing at least one of metal particles and metal oxide particles on the support body; a second process of forming a sintering layer by irradiating an electromagnetic wave pulse on the precursor layer; and a third process of compressing the sintering layer, wherein the conductive layer is formed by repeating the first to third processes “N” times, where “N” denotes a natural number equal to or greater than 2, on the same location of the support body, and the third process performed in the first to (N−1)th operations includes forming a surface of the sintering layer in an uneven shape. ### Claim 2 (depends on 1) The method according to claim 1, wherein the uneven surface of the sintering layer compressed in the third process of the first to (N−1)th operations includes convex portions, and each of the convex portions has a trapezoidal cross-sectional shape narrowed toward a tip end surface or a rectangular cross-sectional shape. ### Claim 3 (depends on 2) The method according to claim 2, wherein the convex portions include protrusions arranged in a matrix shape. ### Claim 4 (depends on 3) The method according to claim 3, wherein at least one of the third processes performed in the first to (N−1)th operations includes forming the surface of the sintering layer in an uneven shape by pressing a first pressing tool to the surface of the sintering layer and then pressing a second pressing tool to the surface of the sintering layer, the first pressing tool has a first pressing surface including first grooves that extend along a first direction and are arranged in parallel with each other, and the second pressing tool has a second pressing surface including second grooves that extend along a second direction crossing the first direction and are arranged in parallel with each other. ### Claim 5 (depends on 3) The method according to claim 3, wherein at least one of the third processes performed in the first to (N−1)th operations includes forming the surface of the sintering layer in an uneven shape by pressing a pressing tool to the surface of the sintering layer, the pressing tool has a pressing surface including concave portions shaped to correspond to the protrusions, and the concave portions are arranged on the pressing surface to correspond to the arrangement of the protrusions. ### Claim 6 (depends on 2) The method according to claim 2, wherein the convex portions include walls extending along a first direction, and the walls are arranged in parallel with each other. ### Claim 7 (depends on 6) The method according to claim 6, wherein at least one of the third processes performed in the first to (N−1)th operations includes forming the surface of the sintering layer in an uneven shape by pressing a pressing tool to the surface of the sintering layer, and the pressing tool has a pressing surface including grooves that extend along the first direction and are arranged in parallel with each other. ### Claim 8 (depends on 1) The method according to claim 1, wherein the first process includes: arranging a dispersion liquid containing at least one of the metal particles and the metal oxide particles on the support body; and forming the precursor layer by drying the dispersion liquid. ### Claim 9 (depends on 1) The method according to claim 1, wherein the third process of the (N)th operation includes forming the surface of the sintering layer in a flat shape. ### Claim 10 A wiring board comprising: a substrate; and a conductive layer provided on the substrate, wherein the conductive layer includes: a conductive portion containing metal and having electric conductivity; and at least an insulating portion containing metal oxide and having an electric insulation property, the insulating portion is buried in the conductive portion and extends in a layered state along substantially the same direction as an extending direction of the substrate, and the insulating portion comprises penetrating portions where the conductive portion penetrates. ### Claim 11 (depends on 10) The wiring board according to claim 10, wherein the penetrating portions include through-holes arranged in a matrix shape in the insulating portion. ### Claim 12 (depends on 10) The wiring board according to claim 10, wherein the penetrating portions include slits arranged in parallel with each other in the insulating portion.