# US 2018/0027654 A1 · Board and electronic device

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- Number: US 2018/0027654 A1
- Document ID: US20180027654A1
- Status: Published application
- Kind: A1
- Application number: 15/613,427
- Filed: 2017-06-05
- Published: 2018-01-25
- Earliest claimed: 2016-07-20
- Assignees: Fujitsu Limited
- Applicants: Fujitsu Limited
- Inventors: Takashi KANDA; Shunji Baba
- Web page: https://patentgrep.com/patent/US20180027654A1

## CPC

- H05K 1/092: {Dispersed materials, e.g. conductive pastes or inks}
- H05K 1/0283: {Stretchable printed circuits}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions}
- H05K 1/181: associated with surface mounted components
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 3/246: {Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating}
- H05K 1/0277: {Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence)}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A board includes a substrate having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other. And an electronic device includes a board having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other.

## Claims

### Claim 1

A board comprising:
a substrate having a bending property;
a wiring pattern formed over the substrate and having a bending property;
a conductive member formed over the wiring pattern;
an electronic component; and
a bonding member that bonds the conductive member and the electronic component to each other.

### Claim 2 (depends on 1)

The board according to claim 1, wherein the wiring pattern includes a resin and conductive particles,
the conductive member is a metal foil, metal plating, or metal powder, and
the bonding member includes a resin and conductive particles, or the bonding member includes a solder.

### Claim 3 (depends on 1)

The board according to claim 1, wherein the conductive member is a metal foil, and an incision is formed in an outer peripheral portion of the metal foil.

### Claim 4 (depends on 1)

The board according to claim 1, wherein the conductive member is a metal foil, metal plating, or metal powder, and
an electrical resistivity of the metal foil, the metal plating, and the metal powder is smaller than an electrical resistivity of the wiring pattern.

### Claim 5 (depends on 1)

The board according to claim 1, wherein the wiring pattern includes a resin and conductive particles,
the conductive member includes a resin and conductive particles,
the bonding member includes a resin and conductive particles,
the resin included in the wiring pattern is different in type from the resin included in the bonding member, and
the resin included in the wiring pattern is identical in type to the resin included in the bonding member.

### Claim 6

An electronic device comprising:
a board having a bending property;
a wiring pattern formed over the substrate and having a bending property;
a conductive member formed over the wiring pattern;
an electronic component; and
a bonding member that bonds the conductive member and the electronic component to each other.