# US 2018/0027645 A1 · Substrate unit

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- Number: US 2018/0027645 A1
- Document ID: US20180027645A1
- Status: Published application
- Kind: A1
- Application number: 15/549,312
- Filed: 2016-01-29
- Published: 2018-01-25
- Earliest claimed: 2015-02-19
- Assignees: Autonetworks Technologies, Ltd.; Sumitomo Wiring Systems, Ltd.; Sumitomo Electric Industries, Ltd.
- Applicants: AutoNetworks Technologies, Ltd.; Sumitomo Wiring Systems, Ltd.; Sumitomo Electric Industries, Ltd.
- Inventors: Hideaki Tahara; Kazuyoshi Ohara; Munsoku O; Arinobu Nakamura
- Web page: https://patentgrep.com/patent/US20180027645A1

## CPC

- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/02: Details
- H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs
- H05K 7/205: {Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201)}
- H05K 7/20509: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures}
- H10W 40/10: Arrangements for heating
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers}
- H10W 70/68: Shapes or dispositions thereof
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a substrate unit that has an excellent heat dissipation capability. A substrate unit includes: a substrate having a conductive pattern formed on one surface thereof, the substrate being provided with an opening; a conductive member that includes a main portion that is fixed to the other surface of the substrate, and to which at least one terminal of an electronic component is electrically connected via the opening that is formed in the substrate; and a heat dissipation member with which an extension portion that extends from the main portion of the conductive member is in contact.

## Claims

### Claim 1

A substrate unit comprising:
a substrate having a conductive pattern formed on one surface thereof, the substrate being provided with an opening;
a conductive member that includes a main portion that is fixed to the other surface of the substrate, and to which at least one terminal of an electronic component is electrically connected via the opening that is provided in the substrate; and
a heat dissipation member with which an extension portion that extends from the main portion of the conductive member is in contact.

### Claim 2 (depends on 1)

The substrate unit according to claim 1,
wherein the extension portion is in contact with the heat dissipation member with an insulative material being interposed therebetween.

### Claim 3 (depends on 1)

The substrate unit according to claim 1,
wherein the extension portion of the conductive member passes outside the substrate.

### Claim 4 (depends on 1)

The substrate unit according to claim 1,
wherein the extension portion of the conductive member penetrates through the substrate.

### Claim 5 (depends on 4)

The substrate unit according to claim 4,
wherein the extension portion of the conductive member, which penetrates through the substrate, is fixed to the substrate.

### Claim 6 (depends on 1)

The substrate unit according to claim 1,
wherein the heat dissipation member is arranged on the side of the one surface of the substrate.

### Claim 7 (depends on 6)

The substrate unit according to claim 6,
wherein the heat dissipation member is not in contact with the electronic component.

### Claim 8 (depends on 2)

The substrate unit according to claim 2,
wherein the extension portion of the conductive member passes outside the substrate.

### Claim 9 (depends on 2)

The substrate unit according to claim 2,
wherein the extension portion of the conductive member penetrates through the substrate.

### Claim 10 (depends on 9)

The substrate unit according to claim 9,
wherein the extension portion of the conductive member, which penetrates through the substrate, is fixed to the substrate.

### Claim 11 (depends on 2)

The substrate unit according claim 2,
wherein the heat dissipation member is arranged on the side of the one surface of the substrate.

### Claim 12 (depends on 3)

The substrate unit according claim 3,
wherein the heat dissipation member is arranged on the side of the one surface of the substrate.

### Claim 13 (depends on 4)

The substrate unit according claim 4,
wherein the heat dissipation member is arranged on the side of the one surface of the substrate.

### Claim 14 (depends on 5)

The substrate unit according claim 5,
wherein the heat dissipation member is arranged on the side of the one surface of the substrate.