# US 2018/0027153 A1 · Image sensing device with cover plate having optical pattern thereon > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0027153 A1 - Document ID: US20180027153A1 - Status: Published application - Kind: A1 - Application number: 15/679,144 - Filed: 2017-08-16 - Published: 2018-01-25 - Earliest claimed: 2014-11-24 - Assignees: Himax Technologies Limited; Himax Imaging Limited - Applicants: Himax Technologies Limited; Himax Imaging Limited - Inventors: Chung-Chi CHEN; Wen-Shun WU; Kuo-Liang TAI - Web page: https://patentgrep.com/patent/US20180027153A1 ## CPC - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H04N 25/704: Pixels specially adapted for focusing, e.g. phase difference pixel sets - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract An image sensing module is provided, which includes an image sensor, a cover plate and microstructures. The image sensor has a light sensitive area for receiving incident light and a peripheral area surrounding the light sensitive area. The microstructures are directly on the cover plate. The microstructures map to and substantially cover phase detection auto focus (PDAF) pixels of the image sensor in a light incident direction respectively. ## Claims ### Claim 1 An image sensing module, comprising: an image sensor having a light sensitive area for receiving incident light and a peripheral area surrounding the light sensitive area; a cover plate over the image sensor; and a plurality of microstructures directly on the cover plate, the microstructures mapping to and substantially covering a plurality of phase detection auto focus (PDAF) pixels of the image sensor in a light incident direction respectively. ### Claim 2 (depends on 1) The image sensing module of claim 1, wherein the microstructures and the cover plate are an integrated structure. ### Claim 3 (depends on 1) The image sensing module of claim 1, wherein the microstructures comprise glass, resin, epoxy or silicone-base polymer. ### Claim 4 (depends on 1) The image sensing module of claim 1, wherein a distance between the image sensor and the cover plate is substantially 10 micrometers. ### Claim 5 (depends on 1) The image sensing module of claim 1, further comprising at least one alignment mark on the cover class for a lens module to be aligned with the image sensing module, the at least one alignment mark located above the peripheral area of the image sensor. ### Claim 6 A method of fabricating an image sensing module, the method comprising: providing an image sensor having an light sensitive area for receiving incident light and a peripheral area surrounding the light sensitive area; mounting a cover plate over the image sensor, the cover plate having a plurality of microstructures formed directly thereon, the microstructures mapping to and substantially covering a plurality of phase detection auto focus (PDAF) pixels of the image sensor in a light incident direction respectively. ### Claim 7 (depends on 6) The method of claim 6, wherein the microstructures are made by monolithic process technology or wafer-level process technology. ### Claim 8 (depends on 6) The method of claim 6, wherein the microstructures are formed from glass, resin, epoxy or silicone-base polymer. ### Claim 9 (depends on 6) The method of claim 6, wherein the cover plate is spaced from the image sensor at a distance of substantially 10 micrometers. ### Claim 10 (depends on 6) The method of claim 6, further comprising: forming at least one alignment mark on the cover class for a lens module to be aligned with the image sensing module, the at least one alignment mark located above the peripheral area of the image sensor. ### Claim 11 A camera apparatus, comprising: a lens module for directing incident light; and an image sensing module comprising: an image sensor having a light sensitive area for receiving the incident light penetrating through the lens module and a peripheral area surrounding the light sensitive area; a cover plate over the image sensor; and a plurality of microstructures directly on the cover plate, the microstructures mapping to and substantially covering a plurality of phase detection auto focus (PDAF) pixels of the image sensor in a light incident direction respectively. ### Claim 12 (depends on 11) The camera apparatus of claim 11, wherein the microstructures and the cover plate are an integrated structure. ### Claim 13 (depends on 11) The camera apparatus of claim 11, wherein the microstructures comprise glass, resin, epoxy or silicone-base polymer. ### Claim 14 (depends on 11) The camera apparatus of claim 11, wherein a distance between the image sensor and the cover plate is substantially 10 micrometers. ### Claim 15 (depends on 11) The camera apparatus of claim 11, wherein the image sensing module further comprises at least one first alignment mark on the cover class, and the lens module further comprises at least one second alignment mark for aligning with the at least one first alignment mark respectively. ### Claim 16 (depends on 11) The camera apparatus of claim 11, further comprising: a substrate for mounting the image sensing device. ### Claim 17 (depends on 16) The camera apparatus of claim 16, further comprising a holder on the substrate for accommodating the lens module. ### Claim 18 (depends on 17) The camera apparatus of claim 17, further comprising an infrared (IR) cut-off filter in the holder and between the image sensing module and the lens module. ### Claim 19 (depends on 16) The camera apparatus of claim 16, wherein the substrate is a printed circuit board (PCB). ### Claim 20 (depends on 16) The camera apparatus of claim 16, wherein the substrate is a flexible printed circuit (FPC) board.