# US 2018/0026423 A1 · Mechanically isolated optically pumped semiconductor laser

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2018/0026423 A1
- Document ID: US20180026423A1
- Status: Published application
- Kind: A1
- Application number: 15/648,317
- Filed: 2017-07-12
- Published: 2018-01-25
- Earliest claimed: 2016-07-20
- Assignees: Coherent, Inc.
- Applicants: Coherent, Inc.
- Inventors: Jeffrey Alan WISDOM
- Web page: https://patentgrep.com/patent/US20180026423A1

## CPC

- H01S 5/02325: Mechanically integrated components on mount members or optical micro-benches
- H01S 5/02315: Support members, e.g. bases or carriers
- H01S 5/0233: Mounting configuration of laser chips
- H01S 5/0235: Method for mounting laser chips
- H01S 5/024: Arrangements for thermal management
- H01S 5/02438: {Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens}
- H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC}
- H01S 5/02476: {Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements}
- H01S 5/041: {Optical pumping}
- H01S 5/0654: {Single longitudinal mode emission}
- H01S 5/141: {using a wavelength selective device, e.g. a grating or etalon (H01S5/146 takes precedence)}
- H01S 3/08036: using intracavity dispersive, polarising or birefringent elements
- H01S 5/183: having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S 2301/163: Single longitudinal mode
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL

## Abstract

A housing for an optically pumped semiconductor (OPS) laser resonator is terminated at one end thereof by an OPS-chip. The laser resonator is assembled on a platform with the OPS-chip at one end of the platform. The platform is fixedly attached to a baseplate at the OPS-chip end of the platform. The remainder of the platform extends over the baseplate with a gap between the platform and the baseplate. A pump-laser is mounted directly on the baseplate and delivers pump radiation to the OPS-chip.

## Claims

### Claim 1

Laser apparatus, comprising:
a cantilever platform having first and second opposite ends;
a baseplate having first and second opposite surfaces;
an optically pumped semiconductor (OPS) laser-resonator including an OPS-chip, the OPS laser-resonator assembled on the cantilever platform with the OPS-chip bonded to a heat-sink attached to the first end of the cantilever platform;
wherein the first end of the cantilever platform is supported on the baseplate, and a remaining portion of cantilever platform including the second end thereof extends over the baseplate with a gap between the remaining portion of the cantilever platform and the baseplate; and
wherein a pump-radiation source is mounted on the first surface of the baseplate and arranged to deliver optical pump radiation to the OPS-chip for energizing the OPS laser-resonator.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the gap between the remaining portion of the cantilever platform and the baseplate is provided by a trough formed in the first surface of the baseplate.

### Claim 3 (depends on 2)

The apparatus of claim 2, wherein the cantilever platform is rectangular and the trough is rectangular.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein the pump radiation source includes a diode-laser.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein the laser resonator is a folded laser resonator.

### Claim 6 (depends on 1)

The apparatus of claim 1, further including a heat-sink attached to the second surface of the baseplate.

### Claim 7 (depends on 1)

The apparatus of claim 1 wherein one end of the laser-resonator terminates in the OPS-chip.