# US 2018/0026342 A1 · Electronic module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0026342 A1 - Document ID: US20180026342A1 - Status: Published application - Kind: A1 - Application number: 15/243,762 - Filed: 2016-08-22 - Published: 2018-01-25 - Earliest claimed: 2016-07-21 - Assignees: Universal Scientific Industrial (Shanghai) Co., Ltd. - Applicants: Universal Scientific Industrial (Shanghai) Co., Ltd. - Inventors: Hsin-Hong CHEN; Jui-Kun SHIH; Chun-Huang LI - Web page: https://patentgrep.com/patent/US20180026342A1 ## CPC - H01Q 1/243: {with built-in antennas} - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/36: Structural form of radiating elements, e.g. cone, spiral, umbrella; {Particular materials used therewith}(H01Q1/08, H01Q1/14 take precedence) - H01Q 1/48: Earthing means; Earth screens; Counterpoises - H01Q 21/00: Antenna arrays or systems (arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system H01Q3/00) - H01Q 21/0025: {Modular arrays} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract The present disclosure provides an electronic module. The electronic module comprises an IC, a substrate and an antenna. The substrate has a top surface, a bottom surface and a lateral surface. The IC is electrically connected to the bottom surface. The antenna is disposed on at least two of the top surface, the bottom surface and the lateral surface. ## Claims ### Claim 1 An electronic module, comprising: an integrated circuit (IC); a substrate having a top surface, a bottom surface and a lateral surface, the IC electrically connected to the bottom surface; and an antenna disposed on at least two of the top surface, the bottom surface and the lateral surface. ### Claim 2 (depends on 1) The electronic module according to claim 1, wherein the antenna is disposed on the top surface and the lateral surface. ### Claim 3 (depends on 1) The electronic module according to claim 1, wherein the antenna is disposed on the top surface and the bottom surface. ### Claim 4 (depends on 1) The electronic module according to claim 1, wherein the antenna is disposed on the top surface, the bottom surface and the lateral surface. ### Claim 5 (depends on 1) The electronic module according to claim 1, further comprising a plurality of solder balls disposed on the bottom surface for mounting the IC and the substrate on a circuit board. ### Claim 6 (depends on 1) The electronic module according to claim 1, further comprising a frame board disposed on the bottom surface for electrically connecting the IC and the substrate to a circuit board. ### Claim 7 (depends on 6) The electronic module according to claim 6, wherein an exterior surface of the frame board and the lateral surface of the substrate substantially form a plane, and the antenna is disposed on the top surface and the plane. ### Claim 8 (depends on 6) The electronic module according to claim 6, wherein an exterior surface of the frame board and the lateral surface of the substrate are not coplanar, and the antenna is disposed on the top surface, the lateral surface and the bottom surface. ### Claim 9 (depends on 6) The electronic module according to claim 6, further comprising: a grounding layer disposed on the substrate; and a grounding plane within the frame board. ### Claim 10 An electronic module, comprising: an integrated circuit (IC); a substrate having a top surface, a bottom surface and a lateral surface, the IC electrically connected to the bottom surface; a first antenna array disposed on the top surface; a second antenna array disposed on the lateral surface; and a third antenna array disposed on the bottom surface. ### Claim 11 (depends on 10) The electronic module according to claim 10, wherein the first antenna array on the top surface, the second antenna array on the lateral surface and the third antenna array on the bottom surface are individual antenna arrays. ### Claim 12 (depends on 10) The electronic module according to claim 10, wherein the first antenna array on the top surface, the second antenna array on the lateral surface and the third antenna array on the bottom surface are connected to each other to form an antenna array. ### Claim 13 (depends on 10) The electronic module according to claim 10, wherein the first antenna array, the second antenna array and the third antenna array are configured to transmit and receive signal in a first frequency band in case that the first antenna array on the top surface, the second antenna array on the lateral surface and the third antenna array on the bottom surface are individual antenna arrays. ### Claim 14 (depends on 13) The electronic module according to claim 13, wherein the first antenna array, the second antenna array and the third antenna array are configured to transmit and receive signal in a second frequency band in case that the first antenna array on the top surface, the second antenna array on the lateral surface and the third antenna array on the bottom surface are connected to each other to form an antenna array. ### Claim 15 (depends on 14) The electronic module according to claim 14, wherein the first frequency band is higher than the second frequency band. ### Claim 16 An electronic module, comprising: an integrated circuit (IC); a substrate having a top surface, a bottom surface and a lateral surface, the IC electrically connected to the bottom surface; an antenna disposed on at least two of the top surface, the bottom surface and the lateral surface; and a frame board disposed on the bottom surface for electrically connecting the substrate to a circuit board. ### Claim 17 (depends on 16) The electronic module according to claim 16, wherein an exterior surface of the frame board and the lateral surface of the substrate substantially form a plane, and the antenna is disposed on the top surface and the plane. ### Claim 18 (depends on 16) The electronic module according to claim 16, wherein an exterior surface of the frame board and the lateral surface of the substrate are not coplanar, and the antenna is disposed on the top surface, the lateral surface and the bottom surface. ### Claim 19 (depends on 16) The electronic module according to claim 16, further comprising: a grounding layer disposed on the substrate; and a grounding plane within the frame board. ### Claim 20 (depends on 19) The electronic module according to claim 19, wherein the grounding plane is electrically connected to the grounding layer.