# US 2018/0026232 A1 · Thin-film package for organic light-emitting diode, organic light-emitting diode, and organic light-emitting display

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2018/0026232 A1
- Document ID: US20180026232A1
- Status: Published application
- Kind: A1
- Application number: 15/455,287
- Filed: 2017-03-10
- Published: 2018-01-25
- Earliest claimed: 2016-07-22
- Assignees: EverDisplay Optronics (Shanghai) Limited
- Applicants: EverDisplay Optronics (Shanghai) Limited
- Inventors: Ling XIAO
- Web page: https://patentgrep.com/patent/US20180026232A1

## CPC

- H10K 59/8731: {multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers}
- H10K 2102/00: Constructional details relating to the organic devices covered by this subclass
- H10K 2102/311: {Flexible OLED}
- H10K 2102/351: {Thickness}
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

The present invention relates to a thin-film package for an organic light-emitting diode, an organic light-emitting diode using the thin-film package, and an organic light-emitting display. The thin-film package includes at least one inorganic film layer and at least one organic film layer, the inorganic film layer and the organic film layer being alternately stacked; the inorganic film layer is made of a material selected from any one of poly(silicon nitride), poly(silicon oxide), poly(silicon carbonitride), poly(silicon carbooxide), poly(silicon carbonitride) and poly(silicon carbonitrideoxide), or any combination thereof; and the organic film layer is made of a material selected from any one of acrolein-based polymer, silicon-based polymer and epoxy-based polymer, or any combination thereof. Compared with a traditional thin-film package structure, the thin-film package according to the present invention achieves a better water and oxygen resistant effect, suffers from a lower stress, and is thus suitable for use in a flexible OLED.

## Claims

### Claim 1

A thin-film package for an organic light-emitting diode, comprising at least one inorganic film layer and at least one organic film layer, the inorganic film layer and the organic film layer being alternately stacked; wherein:
the inorganic film layer is made of a material selected from any one of poly(silicon nitride), poly(silicon oxide), poly(silicon oxynitride), poly(silicon carbonitride), poly (silicon carbooxide) and poly(silicon carbonitrideoxide), or any combination thereof; and
the organic film layer is made of a material selected from any one of acrolein-based polymer, silicon-based polymer and epoxy-based polymer, or any combination thereof.

### Claim 2 (depends on 1)

The thin-film package according to claim 1, wherein:
the thin-film package has a structure of 2 to 100 layers of alternately stacked inorganic film layers and organic film layers, and the thin-film package has a total thickness of 50 nm to 50 μm; and
the inorganic film layers have a thickness of 10 nm to 20 μm, and the organic film layers have a thickness of 50 nm to 30 μm.

### Claim 3 (depends on 2)

The thin-film package according to claim 2, wherein:
the thin-film package has a structure of 2 to 50 layers; and
the inorganic film layers have a thickness of 10 nm to 20 μm, and the organic film layers have a thickness of 50 nm to 30 μm.

### Claim 4 (depends on 1)

The thin-film package according to claim 1, wherein:
the inorganic film layer is made of poly(silicon nitride).

### Claim 5 (depends on 2)

The thin-film package according to claim 2, wherein:
the inorganic film layer is made of poly(silicon nitride).

### Claim 6 (depends on 1)

The thin-film package according to claim 1, wherein:
the inorganic film layer is formed by means of spin coating, spray coating, screen printing, ink-jet printing, thermal deposition or drop coating.

### Claim 7 (depends on 1)

An organic light-emitting diode, comprising:
a substrate;
a display element disposed on the substrate; and
a thin-film package disposed on the substrate for packaging the display element; wherein:
the thin-film package is the thin-film package as defined in claim 1.

### Claim 8 (depends on 7)

The organic light-emitting diode according to claim 7, wherein:
in the thin-film package, a layer most proximal to the display element is the inorganic film layer.

### Claim 9 (depends on 7)

The organic light-emitting diode according to claim 7, wherein:
the substrate is a flexible substrate.

### Claim 10 (depends on 7)

The organic light-emitting diode according to claim 7, wherein:
the thin-film package has a structure of 2 to 100 layers of alternately stacked inorganic film layers and organic film layers, and the thin-film package has a total thickness of 50 nm to 50 μm; and
the inorganic film layers have a thickness of 10 nm to 20 μm, and the organic film layers have a thickness of 50 nm to 30 μm.

### Claim 11 (depends on 10)

The organic light-emitting diode according to claim 10, wherein:
the thin-film package has a structure of 2 to 50 layers; and
the inorganic film layers have a thickness of 10 nm to 20 μm, and the organic film layers have a thickness of 50 nm to 30 μm.

### Claim 12 (depends on 7)

The organic light-emitting diode according to claim 7, wherein:
the inorganic film layer is made of poly(silicon nitride).

### Claim 13 (depends on 7)

The organic light-emitting diode according to claim 7, wherein:
the inorganic film layer is formed by means of spin coating, spray coating, screen printing, ink-jet printing, thermal deposition or drop coating.

### Claim 14 (depends on 7)

An organic light-emitting display using the organic light-emitting diode as defined in claim 7.

### Claim 15 (depends on 14)

The organic light-emitting display according to claim 14, wherein:
the thin-film package has a structure of 2 to 100 layers of alternately stacked inorganic film layers and organic film layers, and the thin-film package has a total thickness of 50 nm to 50 μm; and
the inorganic film layers have a thickness of 10 nm to 20 μm, and the organic film layers have a thickness of 50 nm to 30 μm.

### Claim 16 (depends on 15)

The organic light-emitting display according to claim 15, wherein:
the thin-film package has a structure of 2 to 50 layers; and
the inorganic film layers have a thickness of 10 nm to 20 μm, and the organic film layers have a thickness of 50 nm to 30 μm.

### Claim 17 (depends on 14)

The organic light-emitting display according to claim 14, wherein:
the inorganic film layer is made of poly(silicon nitride).

### Claim 18 (depends on 14)

The organic light-emitting display according to claim 14, wherein:
the inorganic film layer is formed by means of spin coating, spray coating, screen printing, ink-jet printing, thermal deposition or drop coating.

### Claim 19 (depends on 14)

The organic light-emitting display according to claim 14, wherein:
in the thin-film package, a layer most proximal to the display element is the inorganic film layer.

### Claim 20 (depends on 14)

The organic light-emitting display according to claim 14, wherein:
the substrate is a flexible substrate.