# US 2018/0026191 A1 · Organic light emitting diode display

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- Number: US 2018/0026191 A1
- Document ID: US20180026191A1
- Status: Published application
- Kind: A1
- Application number: 15/721,506
- Filed: 2017-09-29
- Published: 2018-01-25
- Earliest claimed: 2011-06-10
- Assignees: Samsung Display Co., Ltd.
- Applicants: Samsung Display Co., Ltd.
- Inventors: Jung-Hyun SON; Hoon KIM
- Web page: https://patentgrep.com/patent/US20180026191A1

## CPC

- B32B 37/12: characterised by using adhesives
- C09J 11/04: inorganic
- H10K 50/8426: {Peripheral sealing arrangements, e.g. adhesives, sealants}
- H10K 50/844: Encapsulations
- H10K 50/846: {comprising getter material or desiccants}
- H10K 59/8722: {Peripheral sealing arrangements, e.g. adhesives, sealants}
- H10K 59/874: {including getter material or desiccant}
- H10K 71/50: Forming devices by joining two substrates together, e.g. lamination techniques
- B32B 2457/206: Organic displays, e.g. OLED
- H10K 59/873: {Encapsulations}
- H10K 71/00: Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K 2102/331: {Nanoparticles used in non-emissive layers, e.g. in packaging layer}
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Disclosed is an organic light emitting diode (OLED) display comprising a substrate; an organic light emitting element disposed on the substrate; an encapsulation substrate disposed on the organic light emitting element; and an adhesive layer formed on the substrate, covering the organic light emitting element, and bonding the substrate on which the organic light emitting element is formed with the encapsulation substrate.

## Claims

### Claim 1

A method for manufacturing an organic light emitting diode (OLED) display comprising
forming an organic light emitting element on a substrate;
sequentially accumulating a first filling adhesive layer, a hygroscopic adhesive layer and a second filling adhesive layer so as to form an adhesive layer; and
intervening an adhesive layer between the substrate on which the organic light emitting element is formed and an encapsulation substrate so as to bond them.

### Claim 2 (depends on 1)

The method of claim 1, wherein the adhesive layer comprising sequentially accumulated first filling adhesive layer, hygroscopic adhesive layer and second filling adhesive layer is formed by a roll to roll process, a roll to glass process, a press process or a diaphragm process.

### Claim 3 (depends on 1)

The method of claim 1, wherein after forming the adhesive layer on the encapsulation substrate, bonding with the substrate on which the organic light emitting element is formed is carried out by a lamination process, a press process or a diaphragm process.

### Claim 4 (depends on 1)

The method of claim 1, wherein the hygroscopic adhesive layer includes at least one hygroscopic material selected from the group consisting of silica gel (SiO2.H2O), alumino-silicate beads, montmorillonite, a molecular sieve of zeolite (Na12AlO3SiO2.12H2O), activated carbon, alkali metal oxide, alkaline earth metal oxide, metal sulfate, metal halide and metal perchlorate.

### Claim 5 (depends on 1)

The method of claim 1, wherein the first filling adhesive layer and the second filling adhesive layer independently include at least one filling material selected from the group consisting of talc, silica, magnesium oxide, mica, montmorillonite, alumina, graphite, beryllia (beryllium oxide), aluminum nitride, silicon carbide, mullite and silicon.

### Claim 6 (depends on 1)

The method of claim 1, wherein the filling material or hygroscopic material has a particle diameter of about 10 nm to about 20 μm.

### Claim 7 (depends on 1)

The method of claim 1, wherein the adhesive layer includes thermally curable resin or photocurable resin.