# US 2018/0026090 A1 · Embedded Passive Chip Device and Method of Making the Same

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- Number: US 2018/0026090 A1
- Document ID: US20180026090A1
- Status: Published application
- Kind: A1
- Application number: 15/723,111
- Filed: 2017-10-02
- Published: 2018-01-25
- Earliest claimed: 2015-06-25
- Assignees: Wafer Mems Co., Ltd.
- Applicants: Wafer Mems Co., Ltd.
- Inventors: Min-Ho Hsiao; Pang-Yen Lee; Yen-Hao Tseng
- Web page: https://patentgrep.com/patent/US20180026090A1

## CPC

- H10D 1/20: Inductors
- H01F 17/0006: {Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K)}
- H01F 41/04: for manufacturing coils {(coils for transformer or inductances H01F27/28)}
- H01F 41/046: {structurally combined with ferromagnetic material}
- H10P 54/00: Cutting or separating of wafers, substrates or parts of devices
- H10W 20/043: {for electroplating}
- H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)}
- H01F 2017/0066: {with a magnetic layer}
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An embedded passive chip device includes a chip body and a functional layered structure. The chip body has a circuit-forming surface that is formed with a recess. The functional layered structure is formed on the chip body and includes a conductive layer that has at least a portion which covers at least partially the circuit-forming surface, and a magnetic layer that is disposed within the recess and that is inductively coupled to the conductive layer for generating inductance. A method of making the embedded passive chip device is also disclosed.

## Claims

### Claim 1

An embedded passive chip device comprising:
a chip body having a first circuit-forming surface that is formed with a first recess; and
a first functional layered structure formed on said chip body and including a first conductive layer that has at least a portion which covers at least partially said first circuit-forming surface, and a first magnetic layer that is disposed within said first recess and that is inductively coupled to said first conductive layer for generating inductance.

### Claim 2 (depends on 1)

The embedded passive chip device of claim 1, wherein said chip body is made from a Si-based material or metal.

### Claim 3 (depends on 3)

The embedded passive chip device of claim 3, wherein said first conductive layer is in the form of a coil, and is disposed around said chip body.

### Claim 4 (depends on 3)

The embedded passive chip device of claim 3, wherein said first recess is defined by a recess-defining surface that contacts said magnetic layer and that has a base portion and a surrounding portion which is disposed between and interconnects said base portion and said first circuit-forming surface, said first conductive layer having a spiral part that is formed on said base portion and that contacts and is covered by said magnetic layer, and an extending part that extends from said spiral part and that further extends on and contacts said surrounding portion and said first circuit-forming surface.

### Claim 5 (depends on 4)

The embedded passive chip device of claim 4, wherein said first functional layered structure further includes an insulator layer that is formed on said base portion and that covers a portion of said spiral part, said extending part further extending on said insulator layer.

### Claim 6 (depends on 5)

The embedded passive chip device of claim 5, wherein said first functional layered structure further includes
first and second electrode layers disposed on said magnetic layer, and
a dielectric layer disposed between said first and second electrode layers;
wherein said first and second electrode layers and said dielectric layer cooperatively define a capacitor;
wherein said extending part is electro-connected to at least one of said first and second electrode layers.

### Claim 7 (depends on 1)

The embedded passive chip device of claim 1, wherein said chip body further has a second circuit-forming surface that is opposite to said first circuit-forming surface and that is formed with a second recess, said embedded passive chip device further comprising a second functional layered structure that is formed on said chip body and that includes a second conductive layer extending on said second circuit-forming surface, and a second magnetic layer embedded in said second recess and inductively coupled to said second conductive layer for generating inductance.

### Claim 8 (depends on 7)

The embedded passive chip device of claim 7, wherein said first and second functional layered structures are symmetrical to each other.