# US 2018/0026075 A1 · Integrated circuit components incorporating energy harvesting components/devices, and methods for fabrication, manufacture and production of integrated circuit components incorporating energy harvesting components/devices

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- Number: US 2018/0026075 A1
- Document ID: US20180026075A1
- Status: Published application
- Kind: A1
- Application number: 15/693,457
- Filed: 2017-08-31
- Published: 2018-01-25
- Earliest claimed: 2016-04-09
- Assignees: Face International Corporation
- Applicants: Face International Corporation
- Inventors: Clark D. BOYD
- Web page: https://patentgrep.com/patent/US20180026075A1

## CPC

- H10N 19/00: Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
- H01J 45/00: Discharge tubes functioning as thermionic generators {(structural combination of fuel element with thermoelectric element G21C3/40; nuclear power plants using thermionic converters G21D7/04; structural combination of a radioactive source with a thermionic converter, e.g. radioisotope batteries G21H1/10; generators in which thermal or kinetic energy is converted into electrical energy by ionisation of a fluid and removal of the charge therefrom H02N3/00)}
- H10N 10/00: Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects (integrated devices or assemblies of multiple devices H10N19/00)
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)

## Abstract

An integrated circuit system, structure and/or component is provided that includes an integrated electrical power source in a form of a unique, environmentally-friendly energy harvesting element or component. The energy harvesting component provides a mechanism for generating autonomous renewable energy, or a renewable energy supplement, in the integrated circuit system, structure and/or component. The energy harvesting element includes a first conductor layer, a low work function layer, a dielectric layer, and a second conductor layer that are particularly configured to promote electron migration from the low work function layer, through the dielectric layer, to the facing surface of the second conductor layer in a manner that develops an electric potential between the first conductor layer and the second conductor layer. An energy harvesting component includes a plurality of energy harvesting elements electrically connected to one another to increase a power output of the electric harvesting component.

## Claims

### Claim 1

A method for forming an integrated circuit component, comprising:
providing an integrated circuit element on a substrate;
forming an energy harvesting component on the substrate, the energy harvesting component having a stacked configuration on the substrate totaling less than 100 μm; and
electrically connecting the energy harvesting component to the integrated circuit element,
the energy harvesting component being configured to generate and electric potential at any temperature above absolute zero for powering the integrated circuit element.

### Claim 2 (depends on 1)

The method of claim 1, the forming the energy harvesting component on the substrate comprising forming an energy harvesting element by:
forming a first conductor layer of a conductive material on the substrate;
forming a low work function layer on a facing surface of the first conductor layer;
arranging a second conductor layer formed of a conductive material to have a facing surface facing the low work function layer with a gap formed between the low work surface layer and the facing surface of the second conductor layer, the gap being in a range of 100 nm or less in thickness in a direction orthogonal to the facing surface of the second conductor layer, the facing surface of the second conductor having a work function substantially higher than a work function of the low work function layer.

### Claim 3 (depends on 1)

The method of claim 1, the low work function layer being formed as at least one of a separate physical layer in intimate contact with the first surface of the first conductor layer, and a surface treatment applied to the first surface of the first conductor layer to lower the work function of the first surface of the first conductor layer.

### Claim 4 (depends on 1)

The method of claim 1, further comprising forming a dielectric layer in the gap.

### Claim 5 (depends on 4)

The method of claim 4, the dielectric layer having a thickness in a range of 20 nm to 60 nm and being sandwiched between the low work function layer and the facing surface of the second conductor layer.

### Claim 6 (depends on 5)

The method of claim 5, the dielectric layer varying in thickness across a planform of the dielectric layer between the low work function layer and facing surface of the second conductor layer.

### Claim 7 (depends on 5)

The method of claim 5, the dielectric layer being formed at least in part of a plurality of tapered shapes, each of the plurality of tapered shapes having a tapered structure in which a cross-sectional area of the each of the plurality of tapered shapes is comparatively larger at an end facing the first surface of the second conductor layer and comparatively smaller at an end facing the low work function layer.

### Claim 8 (depends on 5)

The method of claim 5, the dielectric layer being formed as a porous layer, the method further comprising filling at least some of the pores at least in part with a metal cation.

### Claim 9 (depends on 1)

The method of claim 1, the low work function layer having a work function in a range of 1.0 eV or less and the facing surface of the second conductor layer having a work function in a range of 2.0 eV or greater.

### Claim 10 (depends on 1)

The method of claim 1, the stacked configuration of the energy harvesting component comprising a plurality of energy harvesting elements and a plurality of insulating layers arranged in the stack,
the plurality of energy harvesting elements being separated by the plurality of insulating layers, and
the plurality of energy harvesting elements being electrically interconnected with one another.

### Claim 11 (depends on 10)

The method of claim 10, each of the plurality of insulating layers having a thickness of 1 μm or less.

### Claim 12 (depends on 1)

The method of claim 1, further comprising forming an outer insulating layer substantially encasing the energy harvesting component.

### Claim 13 (depends on 1)

The method of claim 1, further comprising:
electrically connecting a first electric lead and a second electric lead to the energy harvesting component, the first and second electric leads being configured to attach the energy harvesting component to the integrated circuit element.