# US 2018/0026020 A1 · Compact optoelectronic modules

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- Number: US 2018/0026020 A1
- Document ID: US20180026020A1
- Status: Published application
- Kind: A1
- Application number: 15/713,946
- Filed: 2017-09-25
- Published: 2018-01-25
- Earliest claimed: 2013-11-22
- Assignees: Heptagon Micro Optics Pte. Ltd.
- Applicants: Heptagon Micro Optics Pte. Ltd.
- Inventors: Jens Geiger
- Web page: https://patentgrep.com/patent/US20180026020A1

## CPC

- H10W 90/00: Package configurations
- B29D 11/00307: {Producing lens wafers}
- G01S 7/4813: {Housing arrangements}
- H10F 39/804: {Containers or encapsulations}
- H10F 55/25: wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
- H10F 55/255: formed in, or on, a common substrate
- H10F 77/407: {indirectly associated with the devices}
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/8506: {Containers}
- H10W 72/0198: {batch processes}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B29D: PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE (making granules B29B9/00; making preforms B29B11/00)
- G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

Compact optoelectronic modules are described that, in some implementations, can have reduced heights, while at the same time having very little optical crosstalk or detection of stray light. An optoelectronic module having optical channel can include a support on which is mounted an optoelectronic device arranged to emit or detect light at a particular one or more wavelengths. The module has a cover including an optically transmissive portion over the optoelectronic device. The optically transmissive portion is surrounded laterally by sections of the cover that are substantially non-transparent to the one or more wavelengths. A passive optical element is present on a surface of the optically transmissive portion. A spacer separates the support from the cover. The cover can be relatively thin so that the overall height of the module is relatively small.

## Claims

### Claim at position 1

1-12. (canceled)

### Claim 13

A wafer-level fabrication method for making a plurality of optoelectronic modules, the method comprising:
providing a support wafer on which are mounted a plurality of optoelectronic devices each of which is arranged to emit or detect light at a particular one or more wavelengths;
providing an optics wafer that includes optically transmissive portions surrounded laterally by sections that are substantially non-transparent to the one or more wavelengths, each of the transmissive portions including a respective passive optical element on its surface, wherein the non-transparent sections have a thickness of no more than 150 μm; and
attaching the support to the optics wafer by way of a spacer to form a wafer stack.

### Claim 14 (depends on 13)

The method of claim 13 further including separating the wafer stack into multiple optoelectronic modules each of which includes a light emitting channel and a light detecting channel.

### Claim 15

(canceled)

### Claim 16 (depends on 13)

The method of any one of claims 13 wherein the non-transparent sections of the optics wafer are composed of a PCB, polymer or ceramic layer having a coating of a non-transparent material on a least one side.

### Claim 17 (depends on 16)

The method of claim 16 wherein the non-transparent material of the coating is a metal or polymer.

### Claim 18 (depends on 16)

The method of any one of claims 16 wherein both sides of the PCB, polymer or ceramic layer include a non-transparent material coating.

### Claim at position 8

19-20. (canceled)

### Claim 21 (depends on 13)

The method of claim 13 wherein the non-transparent sections of the optics wafer are composed of a non-transparent metal or polymer material sandwiched between first and second layers of a PCB, polymer or ceramic material.

### Claim at position 10

22-26. (canceled)