# US 2018/0026003 A1 · Electrically conductive adhesive film and dicing die bonding film

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- Number: US 2018/0026003 A1
- Document ID: US20180026003A1
- Status: Published application
- Kind: A1
- Application number: 15/527,232
- Filed: 2016-04-12
- Published: 2018-01-25
- Earliest claimed: 2015-04-16
- Assignees: Furukawa Electric Co., Ltd.
- Applicants: Furukawa Electric Co., Ltd.
- Inventors: Naoaki MIHARA; Noriyuki KIRIKAE; Jirou SUGIYAMA
- Web page: https://patentgrep.com/patent/US20180026003A1

## CPC

- C09J 7/10: without carriers
- C09J 7/20: characterised by their carriers
- C09J 7/22: Plastics; Metallised plastics
- C09J 7/30: characterised by the adhesive composition
- C09J 9/02: Electrically-conducting adhesives
- C09J 11/04: inorganic
- C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J 179/04: Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J 201/00: Adhesives based on unspecified macromolecular compounds
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10P 72/7404: {the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer}
- H10W 72/071: {Connecting or disconnecting}
- H10W 72/30: Die-attach connectors
- C08K 3/08: Metals
- C08K 3/16: Halogen-containing compounds
- C08K 2201/001: Conductive additives
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/314: the adhesive layer and/or the carrier being conductive
- C09J 2463/00: Presence of epoxy resin
- C09J 2479/08: polyimide
- H10P 72/7414: {the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support}
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7428: {used to support diced chips prior to mounting}
- H10P 72/7438: {with parts of the auxiliary support remaining in the finished device}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07331: {Connecting techniques}
- H10W 72/075: {of bond wires}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

A means that exhibits excellent heat resistance and mounting reliability when bonding a power semiconductor device on to a metal lead frame, which is also lead-free and places little burden on the environment. Specifically, provided is an electrically conductive adhesive film, which includes metal particles, a thermosetting resin, and a compound having Lewis acidity or a thermal acid generator, wherein the compound having Lewis acidity or thermal acid generator is selected from: boron fluoride or a complex thereof, a protonic acid with a pKa value of −0.4 or lower, or a salt or acid obtained by combining an anion that is the same as the salt thereof with hydrogen ion or any other cation. Further, the present invention provides a dicing die bonding film that is obtained by bonding the electrically conductive adhesive film with a pressure-sensitive adhesive tape.

## Claims

### Claim 1

An electrically conductive adhesive film, which comprises metal particles, a thermosetting resin, and a compound having Lewis acidity or a thermal acid generator, wherein
the compound having Lewis acidity or the thermal acid generator is selected from:
boron fluoride or a complex thereof,
a protonic acid with a pKa value of −0.4 or lower, or
a salt or acid obtained by combining an anion that is the same as the salt of the protonic acid with a pKa value of −0.4 or lower with hydrogen ion or any other cation.

### Claim 2 (depends on 1)

The electrically conductive adhesive film of claim 1, wherein the compound having Lewis acidity or thermal acid generator contains less than 0.1 wt % of antimony and arsenic in total.

### Claim 3 (depends on 1)

The electrically conductive adhesive film of claim 1, wherein the compound having Lewis acidity or the thermal acid generator is selected from: boron fluoride or a complex thereof; fluoroborate salt, or polyfluoroalkyl boronic acid or a salt thereof; polyfluoroaryl boronic acid, polyfluoroalkyl fluorophosphoric acid or a salt thereof; or polyfluoroaryl fluorophosphoric acid or a salt thereof.

### Claim 4 (depends on 1)

The electrically conductive adhesive film of claim 1, wherein the compound having Lewis acidity or thermal acid generator is selected from a salt of aryl sulfonium cation, or a salt of aryl iodonium cation.

### Claim 5 (depends on 1)

The electrically conductive adhesive film of claim 1, wherein the weight ratio of the compound having Lewis acidity or thermal acid generator is 0.3 to 3 wt % and the weight ratio of the metal particles is 70 to 96 wt % in the electrically conductive adhesive film.

### Claim 6 (depends on 1)

The electrically conductive adhesive film of claim 1, wherein the boiling point or sublimation point of the compound having Lewis acidity or thermal acid generator is 200° C. or higher under normal pressure.

### Claim 7 (depends on 1)

The electrically conductive adhesive film of claim 1, wherein the total amount of lead, mercury, antimony, and arsenic is less than 0.1 wt % in the electrically conductive adhesive film.

### Claim 8 (depends on 1)

The electrically conductive adhesive film of claim 1, wherein at least part of the metal particles contains any one of Cu, Ni, or Sn.

### Claim 9 (depends on 1)

The electrically conductive adhesive film of claim 1, wherein the metal particles are a mixture of two or more metals that contains a combination that is mutually capable of forming an intermetallic compound.

### Claim 10 (depends on 9)

The electrically conductive adhesive film of claim 9, wherein at least two metals in the two or more metals are selected from Cu, Ag, Ni, Ti, Al, Sn, Zn, Au, and In.

### Claim 11 (depends on 1)

The electrically conductive adhesive film of claim 1, which, when observed by DSC (Differential Scanning Calorimetry), has at least one endothermic peak at 100° C. to 250° C. prior to sintering that is not observed after sintering.

### Claim 12 (depends on 1)

The electrically conductive adhesive film of claim 1, wherein the thermosetting resin comprises a maleic imide compound that contains two or more units of imide groups in one molecule.

### Claim 13 (depends on 12)

The electrically conductive adhesive film of claim 12, wherein the maleic imide compound comprises a structure that is derived from an aliphatic amine of C10 or more.

### Claim 14 (depends on 1)

The electrically conductive adhesive film of claim 1, which comprises an epoxy compound.

### Claim 15 (depends on 1)

A dicing die bonding film, which is obtained by bonding the electrically conductive adhesive film of claim 1 with a pressure-sensitive adhesive tape.